Non-contact chip module induction antenna board jig

Abstract

The invention provides a non-contact type chip module induction antenna plate jig which comprises an induction antenna plate, an induction coil, a bonding pad, a through hole and a clamping piece probe, the induction coil is etched on the induction antenna plate, the clamping piece probe is connected and fixed to the bonding pad on the induction antenna plate, and the through hole is formed in the clamping piece probe. The chip module to be tested is inserted and fixed by the clamping piece probe, electrical connection between the induction coil and the chip module to be tested is realized through the bonding pad, and the three-section structure of the clamping piece probe has the characteristic of elastic pressure application, so that the chip module to be tested is well fixed, and a welding-free lossless use environment is provided for the chip module to be tested; meanwhile, parasitic parameters of the induction antenna board are measurable and cannot be changed in the use process, a completely consistent test environment can be provided for different chip modules to be tested, the precision and accuracy of test data of the chip modules to be tested are guaranteed, and good test of the chip modules to be tested is achieved; moreover, the non-contact type chip module induction antenna board jig is simple in structure, low in production cost, and capable of realizing rapid and accurate test with lossless replacement.

Description

technical field [0001] The invention relates to the technical field of non-contact chip module testing, and relates to a non-contact chip module inductive antenna board jig. Background technique [0002] Contactless chip module card, also known as radio frequency card, consists of a contactless chip module and an induction antenna. When the radio frequency card enters the working environment of the contactless card reader, the self-inductance coil receives the electromagnetic wave energy of the card reader, and the circuit of the chip rectifies and stabilizes it to obtain a stable working voltage, and then starts to work. In the existing technical solutions, the use of contactless chips is realized through encapsulation and card making. After the encapsulated chips are punched, they form a single chip module, which is attached to the ultra-thin PVC or PET through mechanical winding and ultrasonic pressing. The induction coil is welded, and then laminated with multi-layer PV...

AI Technical Summary

Problems solved by technology

like figure 1 As shown, it is a schematic diagram of the structure of an existing card packaged antenna, which includes a pad 200, an encapsulation body 300, an induction coil 400, a plastic card body 500, and a chip module 100 to be tested. During manufacturing, the chip module 100 to be tested It needs to withstand the effects of external high temperature, pressure and other stresses, which will cause corresponding failure; and the whole process is complicated, and the long production cycle is only suitable for mass production mode

At the same time, if you need to measure other parameters of the chip module to be tested, such as capacitance, or replace the test coil during the test, you can only physically destroy the card body to separate the chip module to be tested, and the card body of the self-inductance coil cannot be used again. Moreover, during the operation process of taking out the chip module to be tested, it is necessary to carry out mechanical disassembly under the condition of high temperature heating. actual needs

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