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Power supply module with sandwich structure

A power module, potential technology, applied to the circuit arrangement on the support structure, the stackable modules, the structural connection of the printed circuit, etc., can solve the problems of small size, improve circuit efficiency, reduce area, avoid high The effect of impedance

Pending Publication Date: 2022-05-17
CHENGDU MONOLITHIC POWER SYST
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Increasing current and smaller volume make the heat dissipation of multi-phase power converters encounter higher challenges

Method used

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  • Power supply module with sandwich structure
  • Power supply module with sandwich structure
  • Power supply module with sandwich structure

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Embodiment Construction

[0024] In the following description, some specific details, such as specific circuit structures in the embodiments and specific parameters of these circuit elements, are used to provide a better understanding of the embodiments of the present invention. It will be understood by those skilled in the art that embodiments of the invention may be practiced even without some details or other combinations of methods, elements, materials, and the like. Additionally, "coupled" as used herein means directly connected or indirectly connected through other circuit elements.

[0025] The embodiments described below will take specific implementation devices and application backgrounds as examples to illustrate the devices and working methods of the embodiments of the present invention, so that those skilled in the art can better understand the present invention. However, those skilled in the art should understand that these descriptions are only exemplary, and are not intended to limit the...

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Abstract

The invention discloses a power module with a sandwich structure. The power module comprises an inductor group, a PCB (Printed Circuit Board) and a power device chip which are stacked, wherein the inductor group comprises a magnetic core and a winding. Meanwhile, the surface of the magnetic core is covered with metal sheets, and every two metal sheets are combined and used for being connected to a high-power pin of a power device chip through a PCB. Compared with the prior art, the power supply module has the advantages that the area on a PCB (Printed Circuit Board) can be reduced, so that the load current / power density is improved. Moreover, the power supply module transmits the output current through the pin (winding) of the inductor, so that the wiring of an output current loop on the PCB can be reduced, the high impedance of the wiring of the PCB is avoided, and the circuit efficiency is improved. In addition, the structure that the power device chip is arranged on the upper portion and the inductor group is arranged on the lower portion can greatly benefit from top cooling systems usually adopted in GPU, CPU and ASIC systems.

Description

technical field [0001] The present invention relates to electronic components, and more particularly, the present invention relates to power module structures. Background technique [0002] Generally, a power converter is used to convert input power into output power with suitable voltage and current for the load. The multi-phase power converter includes multiple power stages connected in parallel and working out of phase, so it has the advantages of small output voltage ripple, fast transient response and low requirement for the rated ripple current of the input capacitor. Due to the above advantages, multiphase power converters are widely used in applications that output high current and low voltage, such as servers, microprocessors, etc. [0003] The rapid development of modern GPU (Graphics Processing Unit) and CPU (Central Processing Unit) has put forward higher and higher requirements for the current capability of multi-phase power converters. At the same time, the v...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/02H05K1/14H01F27/29H01F27/28H01F27/24
CPCH05K7/023H05K1/145H01F27/292H01F27/24H01F27/28H05K2201/1003H01F27/2847H01F27/306H05K2201/10378H05K1/111H05K1/14H05K1/181
Inventor 黄道成原钊苏祎世黄文洋律欣彤
Owner CHENGDU MONOLITHIC POWER SYST