Ultrahigh preferred orientation flexible CuxSe thermoelectric thin film and preparation method and application thereof
A technology of preferential orientation and thermoelectric thin film, which is applied in the manufacture/processing of thermoelectric devices, junction lead-out materials of thermoelectric devices, and the manufacture of final products, etc. Easy-to-control effects
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Embodiment 1
[0045] Using Cu 2 Se alloy target and Cu target, magnetron co-sputtering on polyimide flexible substrate (parameter setting: bottom vacuum lower than 8 × 10 -4 Pa, working vacuum is 0.5Pa, Ar flow is 40sccm, Cu 2 The sputtering power of the Se alloy target is 55W, the sputtering power of the Cu target is 15W, and the Cu target has a sputtering power of 15W. 2 The sputtering time of the Se alloy target was 30 min, and the co-sputtering time of the Cu target was 3 min), and then heat-treated at 300 °C for 30 min to prepare ultra-high preferentially oriented flexible Cu. 1.99 Se thermoelectric thin film.
Embodiment 2
[0047] Using Cu 2 Se alloy target and Cu target, magnetron co-sputtering on polyimide flexible substrate (parameter setting: bottom vacuum lower than 8 × 10 -4 Pa, working vacuum is 0.5Pa, Ar flow is 40sccm, Cu 2 The sputtering power of the Se alloy target is 55W, the sputtering power of the Cu target is 15W, and the Cu target has a sputtering power of 15W. 2 The sputtering time of the Se alloy target was 30 min, and the co-sputtering time of the Cu target was 5 min), and then heat-treated at 300 °C for 30 min to prepare ultra-high preferentially oriented flexible Cu. 2.05 Se thermoelectric thin film.
Embodiment 3
[0049] Using Cu 2 Se alloy target and Cu target, magnetron co-sputtering on polyimide flexible substrate (parameter setting: bottom vacuum lower than 8 × 10 -4 Pa, working vacuum is 0.5Pa, Ar flow is 40sccm, Cu 2 The sputtering power of the Se alloy target is 55W, the sputtering power of the Cu target is 15W, and the Cu target has a sputtering power of 15W. 2 The sputtering time of the Se alloy target was 30 min, and the co-sputtering time of the Cu target was 7 min), and then heat-treated at 300 °C for 30 min to prepare ultra-high preferentially oriented flexible Cu. 2.17 Se thermoelectric thin film.
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