Brush plating method for selective nickel plating in tank

Abstract

The invention discloses a brush plating method for selective nickel plating in a groove. The brush plating method comprises the following steps: step 1, removing marks and dirt in the groove; step 2, surface preparation; 3, material detection preparation; 4, electrolytic decontamination in the to-be-plated bath: starting forward voltage, adding electrolyte into the to-be-plated bath, and brushing back and forth in the to-be-plated bath by using a nickel plating arc-shaped small brush handle along the same direction; 5, activating the metal surface of the to-be-plated bath: starting a reverse voltage, adding an activating solution into the to-be-plated bath, and brushing back and forth in the to-be-plated bath by using a nickel plating arc-shaped small brush in the same direction so as to activate the metal surface of the to-be-plated bath; and 6, nickel plating through autocatalytic reaction deposition, specifically, forward voltage is started, nickel plating liquid medicine is added into a liquid medicine pipe, meanwhile, brush plating is conducted back and forth above the groove opening face of the to-be-plated groove along with the nickel plating liquid medicine pipe in the same direction through a large plane brush, the nickel plating liquid medicine and the metal surface of the part are subjected to the autocatalytic reaction, and a nickel plating layer is formed. A plating layer can be uniform, natural and attractive, and the qualification rate of brush plating is high.

Description

technical field [0001] The invention belongs to the technical field of semiconductor manufacturing, in particular to a brush plating method for selective nickel plating in a groove. Background technique [0002] Surface nickel plating is often used in the manufacturing process of semiconductor equipment. Due to the complex structure and very high precision of such parts, sparking, uneven color, leakage of plating, Local corrosion and other problems, thus affecting the performance and appearance of the workpiece. [0003] There are two existing selective nickel plating methods: 1. Adjust the main salt concentration to increase the pH value; 2. Replace the platinum niobium mesh and adjust the temperature to lower the temperature. The first method solves the problems of uneven color and leakage due to the increase of the concentration of the potion, but due to the high concentration, local corrosion will occur during the brush plating process, resulting in unqualified. The se...

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Problems solved by technology

[0004] The invention mainly solves the problems in the prior art such as sparking, uneven color, missing coating, and local corrosion in the process of selective nickel plating, resulting in poor appearance and performance, and provides a metho

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