Substrate double-sided wiring module and manufacturing method thereof

Abstract

The invention relates to the technical field of electronic circuits, and particularly discloses a substrate double-face wiring module and a manufacturing method thereof.The substrate double-face wiring module comprises an aluminum substrate, an inverter circuit and a driving IC are arranged on the first face of the aluminum substrate, and a PFC circuit and a rectifying circuit are arranged on the second face of the aluminum substrate; a plurality of first pins and second pins are arranged on the left side and the right side of the aluminum substrate respectively, the first pins and the second pins point to opposite directions, the first pins are electrically connected with the inverter circuit and the driving IC respectively, and the second pins are electrically connected with the PFC circuit and the rectifying circuit respectively. The size of the module can be reduced under the condition that the module function is not changed through double-sided wiring of the aluminum substrate, the requirement of the market for module miniaturization is met, a certain functional circuit of the same module can be used in cooperation with other functional circuits in the module and can also be used in cooperation with functional circuits in other modules, and the module is convenient to use. And the application mode is more flexible.

Description

technical field [0001] The invention relates to the technical field of electronic circuits, in particular to a substrate double-sided wiring module. Background technique [0002] Modular Intelligent Power System (Module Intelligent Power System, MIPS) is a power drive product that combines power electronics and integrated circuit technology. It is used to realize the infinitely variable speed adjustment function of the motor speed, and is the core component of frequency conversion home appliances. MIPS not only integrates power switching devices and drive circuits, but also has built-in fault detection circuits such as overvoltage, overcurrent and overheating. With the progress of semiconductor chip manufacturing and packaging technology, some functions realized by the separate devices on the electric control board are also integrated into the MIPS module, such as PFC circuit and rectifier circuit. As MIPS integrates more and more functions, the volume of the package will a...

AI Technical Summary

Problems solved by technology

The current MIPS products make circuits and mount components on one side of the aluminum substrate, while the other side of the aluminum substrate is not used, making the module more and more functions at the same time, the size of the module is also correspondingly larger, which violates the Market demand for product miniaturization

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