A grain peeling device

Abstract

A crystal grain peeling device belongs to the technical field of industrial automation and chip processing. Multiple placement trays. There is a rotating disc on the rotating jacking mechanism. There is a rectangular plate on the peeling mechanism, the rectangular plate is located directly above the rotating plate, a circular hole is formed on the rectangular plate, a peeling cylinder is installed on the upper side of the rectangular plate, and the movable end of the peeling cylinder is provided with a peeling arc plate, and the circular hole is located in the peeling arc. On the moving track of the plate, the rectangular plate is provided with a discharging member, and the discharging end of the discharging member is provided with a slag collecting member. By rotating the lifting mechanism, the placing plate, the peeling mechanism and the positioning mechanism, the invention conveniently, automatically and efficiently completes the peeling operation of the crystal grains after the wafer is split, thereby reducing the operator's participation in the operation process and improving the crystallinity. The degree of automation in pellet peeling.

Description

technical field [0001] The invention relates to the technical fields of industrial automation and chip processing, and in particular, to a device for stripping crystal grains. Background technique [0002] Wafers are often used in the processing and manufacturing of integrated circuits, which are often processed by wafer bar forming, wafer disc cutting, wafer disc grinding, wafer disc vertical and horizontal slitting, processing of circuits on the die, and wafer splitting. Die separation, die peeling and other operations will eventually form die and chips for manufacturing integrated circuits. [0003] Among them, when the wafer is split to separate the die, in order to avoid damage to the circuit or coating on the die during splitting, and to avoid the phenomenon that the die is scattered and splashed during the split, it is often A layer of blue film is attached to both sides of the circle, and in order to improve the connection effect of the blue film, a layer of glue wi...

AI Technical Summary

Problems solved by technology

This stripping method first requires the operator to soak the wafer in hot water. Although the operator wears heat-insulating gloves for protection during the soaking, the long-term operation will still cause harm to the operator's body, and when the wafer is stripped It is also necessary to dry the crystal grains, thereby increasing the process of grain processing; secondly, because the grains are peeled off by hand rubbing, the efficiency is low, and the grains are easily damaged during the rubbing process, so Reduces the quality of the die; finally, this die-stripping method is doped with wafer debris between the die

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