Chip test probe and chip test device

Abstract

The invention provides a chip testing probe and a chip testing device, and belongs to the technical field of chip testing. The chip test probe comprises a test probe body used for detecting an electric signal on a to-be-tested chip when a test end portion of the test probe body is in contact with the to-be-tested chip; the light guide part is made of high-purity silicon dioxide and used for conducting light signals, the light guide part is arranged on the peripheral side surface of the test probe body or in the test probe body, one end of the light guide part is used for being arranged opposite to the chip to be tested, and the other end of the light guide part is used for being connected with an infrared temperature measuring device. And the infrared temperature measuring device calculates the temperature of the chip to be measured according to the received optical signal which is emitted by the chip to be measured and is conducted through the light guide part. According to the chip test probe and the chip test device, the measurement accuracy of the chip temperature can be improved.

Description

Technical field [0001] The invention involves the field of chip testing technology, especially a chip test probe and chip testing device. Background technique [0002] In the process of converting electrical energy into light energy, a large part of the electrical energy is converted into unnecessary thermal energy. The thermal energy will affect the performance and life of the laser chip. Therefore, the laser chip needs to be tested.Filtering chips with performance. [0003] like figure 1 It is shown that the existing technology generally increases thermal resistance on the laser chip 3 to predict the temperature of the laser chip 3 by measuring the resistance value of the thermistor.This scheme needs to add the corresponding test probe 2 to the testing tool to read the information of the thermistor 1.When testing the electrical signal, you still need to test the probe 4. [0004] However, in the process of testing through the thermal resistance, the heat -sensitive resistance i...

AI Technical Summary

Problems solved by technology

[0004] However, in the process of testing through the thermistor, the thermistor needs to be powered on. This process itself will bring additional heat and increase the chip temperature, which will lead to inaccurate test data, and the indirect thermistor The way of testing the chip temperature is also the cause of the error

In addition, in order to increase the location and test points of the bonding thermistor, it is necessary to change the packaging method of the chip, so the chip size cannot be made smaller, and the increased test electric shock (that is, the thermistor and its corresponding test probe) also increases. Difficulty of the test

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