Film stripping liquid for polyimide adhesive film and preparation method of film stripping liquid

A technology for polyimide adhesive film and film stripping, which is applied in the field of stripping liquid for polyimide adhesive film and its preparation, can solve the problems of lack of glue, corroded substrate, polluted thickness, etc., so as to improve the film stripping efficiency. effect, speeding up the peeling speed, and the effect of good application prospects

Pending Publication Date: 2022-06-24
常州亚龙电子科技有限公司
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  • Abstract
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  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] During the coating process of PI liquid, it is unavoidable to have defects such as lack of glue, pollution and uneven thickness. In order to reduce the damage of the substrate, it is necessary to remove the bad PI film and realize the reuse of the substrate. The existing stripping solution usually cannot The PI adhesive film is removed cleanly, and it will also corrode the substrate

Method used

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  • Film stripping liquid for polyimide adhesive film and preparation method of film stripping liquid

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preparation example Construction

[0030] A preparation method of a stripping liquid for a polyimide adhesive film of the present invention comprises the following steps:

[0031] First, 60 parts by weight of one or more of the above-mentioned ether organic solvents, 20 parts by weight of one or more of the above-mentioned aliphatic amines, 1.5 parts by weight of one or more of the above-mentioned anionic surfactants, 15 parts by weight of the above-mentioned One or more of alcoholic solvents and 1.5 parts by weight of one or more of above-mentioned inorganic bases are successively added in the container and mixed;

[0032] Then, under normal temperature conditions, the material in the above-mentioned container is stirred, the rotational speed of the stirrer is adjusted to be 400 rpm to 600 rpm, preferably 500 rpm, and the stirring time is 8 to 12 minutes, preferably 10 minutes. , and after the stirring is completed, the stripping solution for a polyimide adhesive film of the present invention can be obtained. ...

Embodiment 1

[0034] Add 50g tripropylene glycol methyl ether, 13g 1,4-butanediamine, 14g hexanediamine, 1g sodium lauryl sulfate, 1g sodium hexadecyl sulfate, 10g isopropanol, 10g n-propanol and 1g sodium hydroxide Mix in a container, and then stir for 10 minutes at room temperature with a stirring speed of 500 rpm to obtain film stripping solution 1#.

Embodiment 2

[0036] 30g tripropylene glycol methyl ether, 40g ethylene glycol tert-butyl ether, 10g 1,2-dimethylpropylamine, 8g 1,2-propanediamine, 1g sodium dodecylbenzenesulfonate, 5g isopropanol, 5g Methanol and 1 g of potassium hydroxide were added to the container and mixed, and then stirred at a stirring speed of 500 rpm at room temperature for 10 minutes to obtain film stripping solution 2#.

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Abstract

The invention relates to a film stripping solution for polyimide and a preparation method thereof.Aliphatic amine, an alcohol solvent and an ether organic solvent can swell and strip a polyimide adhesive film on a base material, amide which does not react completely in the polyimide adhesive film can further react with inorganic alkali, the film stripping speed can be increased, and the film stripping effect can be improved. And the film stripping effect can also be improved. Experimental data show that the film stripping liquid for polyimide not only can strip a polyimide adhesive film on a base material within a short time, but also has no residual condition on the polyimide adhesive film on the base material, has a better stripping effect, does not cause damage and corrosion conditions to the base material, and is suitable for large-scale production. Good application prospects are realized.

Description

technical field [0001] The invention belongs to the technical field of film stripping liquid, and particularly relates to a film stripping liquid for polyimide adhesive film and a preparation method thereof. Background technique [0002] Polyimide (PI) is a high-performance polymer containing an imide ring on the main chain. The PI solution is polymerized into a polyimide film by coating or electrospinning process under heat treatment or chemical action. It is the most widely used in actual industrial production. [0003] In the coating process of PI liquid, it is inevitable that there will be defects such as lack of glue, pollution and uneven thickness. In order to reduce the damage to the substrate, it is necessary to remove the bad PI film and realize the reuse of the substrate. The PI film is removed cleanly, and it will also corrode the substrate. SUMMARY OF THE INVENTION [0004] The technical problem to be solved by the present invention is to provide a film strip...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J7/25C09J7/30C09J179/08
CPCC09J7/30C09J7/25C09J179/08C09J2301/122C09J2301/502C09J2479/086
Inventor 徐志明吴冬
Owner 常州亚龙电子科技有限公司
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