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A kind of degumming liquid and its preparation method and application

A technology of degumming solution and inorganic base, which is applied in the direction of chemical instruments and methods, detergent compositions, surface active detergent compositions, etc., can solve the problems of organic solvent volatilization by heat, unfavorable health of staff, and pollution of working environment, etc. Achieve the effects of reasonable formula, extended shelf life, stable and safe ingredients

Active Publication Date: 2021-02-05
JIANGXI BAOSHENG SEMICON ENERGY TECH CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

While satisfying the purpose of degumming, the following problems in the degumming process have attracted increasing attention, such as the volatilization of organic solvents by heat, and the decomposition of certain components of the degumming solution, which seriously pollutes the working environment and is not conducive to the health of workers.

Method used

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  • A kind of degumming liquid and its preparation method and application
  • A kind of degumming liquid and its preparation method and application
  • A kind of degumming liquid and its preparation method and application

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0030] The degumming solution provided in this example has the following formula: 47.7kg of water, 20kg of sulfolane, 22kg of diethanolamine, 1.5kg of sodium hydroxide, 1kg of trehalose, 0.3kg of benzotriazole and 3kg of dioctyl sodium sulfosuccinate .

[0031] The preparation method of the degumming solution provided in this example includes the following steps: sequentially weigh each raw material component of the above formula, transfer it to the reaction kettle by a pneumatic diaphragm pump, and stir for 300s in a regular cycle to allow the various raw materials to mix and react evenly , It is obtained after filtering with a precision filter, and is filled with a precision automatic filling machine after passing the inspection.

Embodiment 2

[0033] The present embodiment provides glue removing solution, its formula is as follows: water 55.3kg, sulfolane 25kg, diethanolamine 15kg, potassium hydroxide 1.8kg, trehalose 0.5kg, benzotriazole 0.4kg and fatty alcohol polyoxyethylene ether 2kg, prepare Method is with embodiment 1.

Embodiment 3

[0035] The degumming solution provided in this embodiment has the following formula: 48.1kg of water, 15kg of N-methylpyrrolidone, 30kg of monoethanolamine, 1.2kg of sodium hydroxide, 1.5kg of trehalose, 0.2kg of benzotriazole and fatty alcohol polyoxygen Vinyl ether 4kg, preparation method is with embodiment 1.

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Abstract

The invention relates to the field of cleaning agents for the semiconductor industry, in particular to a glue remover and its preparation method and application. The glue remover includes alcohol amine compound, inorganic base, water-soluble organic solvent, trehalose, benzotriazole, penetrant and water. The above glue remover has a reasonable formula, is not volatile, can completely remove photoresist and will not corrode Semiconductor substrate. Its preparation method includes: successively weighing each raw material component of the above-mentioned formula, using a pneumatic diaphragm pump to transfer it to the reaction kettle, and mixing the raw material components evenly through regular cycle stirring, and filtering it with a precision filter to obtain it. After passing the test, the precision automatic filling machine is used for filling. The preparation method is fully automated, does not introduce impurities and pollution, and is used to remove the photoresist and its residue on the semiconductor substrate, which can achieve a good removal effect and does not cause corrosion to the semiconductor substrate.

Description

technical field [0001] The invention relates to the field of cleaning agents for the semiconductor industry, in particular to a glue remover and its preparation method and application. Background technique [0002] The preparation process of semiconductor devices needs to involve multiple photolithography. The photolithography process mainly includes the steps of coating, exposure, development, corrosion and degumming. In the degumming step, the most important method at present is to use degumming solution. Degumming, the requirement of the degumming solution is: it can completely remove the photoresist, but it cannot corrode the semiconductor substrate. [0003] At present, the degumming solution is mainly composed of polar organic solvent, alkali and water, etc., and the purpose of removing the photoresist on the semiconductor wafer is achieved by immersing the semiconductor wafer in the degumming solution or rinsing the semiconductor wafer with the degumming solution. Wh...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C11D1/28C11D3/60C11D3/34C11D3/30C11D3/04C11D3/37C11D3/28C11D1/72
CPCC11D1/28C11D1/72C11D3/044C11D3/222C11D3/28C11D3/30C11D3/3481
Inventor 舒军
Owner JIANGXI BAOSHENG SEMICON ENERGY TECH CO LTD
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