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Circuit board and manufacturing method thereof

A production method and circuit board technology, applied in the directions of printed circuit manufacturing, printed circuits, printed circuit components, etc., can solve the problems of low plate-making efficiency of circuit boards, and achieve the effect of improving plate-making efficiency, simplifying plate-making processes, and reducing plate-making costs.

Pending Publication Date: 2022-06-24
BEIJING DREAM INK TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In view of this, an object of the present invention is to propose a method for making a circuit board, to solve the problem of low plate-making efficiency of circuit boards in the prior art

Method used

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  • Circuit board and manufacturing method thereof
  • Circuit board and manufacturing method thereof
  • Circuit board and manufacturing method thereof

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Experimental program
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Effect test

Embodiment 1

[0061] An embodiment of the present invention discloses a method for manufacturing a circuit board, comprising:

[0062] Step S21, selecting a substrate;

[0063] Step S22, using composite electronic paste to print on one side of the substrate to form a target circuit;

[0064] Step S23 , forming a first solder resist layer covering the target circuit on the side of the substrate on which the target circuit is formed;

[0065] Step S24, using a digital mask to selectively expose the first solder resist layer;

[0066] Step S25 , developing the exposed first solder resist layer to obtain solder resist openings and concave marks.

[0067] This embodiment is suitable for making a single panel.

Embodiment 2

[0069] An embodiment of the present invention discloses a method for manufacturing a circuit board, comprising:

[0070] Step S31, selecting a substrate;

[0071] Step S32, forming a target circuit by using composite electronic paste printing on both sides of the substrate respectively;

[0072] Step S33, respectively forming a first solder resist layer covering the target circuit on both sides of the base material;

[0073] Step S34, using a digital mask to selectively expose the first solder resist layer;

[0074] Step S35 , developing the exposed first solder resist layer to obtain solder resist openings and concave marks.

[0075] This embodiment is suitable for making double panels.

Embodiment 3

[0077] An embodiment of the present invention discloses a method for manufacturing a circuit board, comprising:

[0078] Step S41, selecting a substrate;

[0079] Step S42, forming a second solder resist layer on a surface of the base material;

[0080] Step S43, forming a target circuit by using composite electronic paste printing on the second solder resist layer;

[0081] Step S44, forming a first solder resist layer covering the target circuit on the side of the base material on which the target circuit is formed;

[0082] Step S45, using a digital mask to selectively expose the first solder resist layer;

[0083] Step S46 , developing the exposed first solder resist layer to obtain solder resist openings and concave marks.

[0084] This embodiment is suitable for making a single panel.

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Abstract

The invention discloses a circuit board and a manufacturing method thereof, and relates to the technical field of electronic circuit manufacturing. The manufacturing process of the circuit board comprises the following steps: selecting a base material; forming a target circuit on at least one surface of the substrate; forming a first solder mask layer covering the target circuit on the substrate; and selectively exposing a partial region of the first solder mask layer, and forming a pad window for exposing the target circuit pad and a concave identifier for indicating the target circuit information on the first solder mask layer after development. According to the embodiment of the invention, the silk-screen mark and the solder resist windowing are integrally formed in a concave mark mode, so that the plate-making process is simplified, the plate-making efficiency of the circuit board is improved, and the plate-making cost is reduced.

Description

technical field [0001] The invention belongs to the technical field of rapid manufacturing of electronic circuits, and in particular relates to a circuit board and a manufacturing method thereof. Background technique [0002] As the support of electronic components, printed circuit boards provide electrical connections for electronic components. The conventional production process of printed circuit boards is generally: cutting → copper coating → etching → developing → solder mask → silk screen characters → surface treatment → Forming processing, although with the continuous iteration of the plate-making process, the current plate-making process of printed circuit boards is various, but its important plate-making links cannot be replaced, such as the solder mask process and the silk screen character process. A solder mask layer with exposed pads is formed on the circuit board to reduce the difficulty of subsequent soldering and to protect the circuit board itself, while the ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/28H05K3/22H05K1/02
CPCH05K3/282H05K3/288H05K3/22H05K1/0266
Inventor 张金权尹涛
Owner BEIJING DREAM INK TECH CO LTD
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