CAM-based copper surface object analysis method

Abstract

The invention discloses a CAM-based copper surface object analysis method, which comprises the following steps of: importing an image graphic description file, analyzing and judging whether a polygonal object has risk information or not according to the type information of each object in the image graphic description file, and the like. Through the mode, the copper surface object analysis method based on the CAM microscopically ensures the yield and management efficiency of a manufacturing end, macroscopically utilizes the analysis system and method to standardly integrate upstream and downstream, accelerates industrial upgrading, and lays a way for opening a full industrial chain for full-automatic full-intelligent manufacturing of PCBs (Printed Circuit Board).

Description

technical field [0001] The invention relates to the technical field of PCB manufacturing, in particular to a method for analyzing copper surface objects based on CAM. Background technique [0002] CAM defines five types of objects (feature): 1. Line object (Line), 2. Arc object (Arc), 3. Pad object (Pad), 4. String object (Text), 5. Copper surface Object (Surface). In a broad sense, all objects on the circuit board are copper objects, but at the computer-aided manufacturing (CAM) level, a narrow copper surface object (Surface) is redefined. [0003] The description of copper surface objects in CAD software is as follows: It is a polygonal outline described by multiple points, and then filled into a surface. [0004] Reasons for copper-clad objects [0005] Generally speaking, we can intuitively understand that in the whole circuit, the three objects of straight line, arc and pad can ideally describe the circuit, while the string object is only for the marked graphics and ...

AI Technical Summary

Problems solved by technology

[0007] 1. If the proportion of the area occupied by metal copper is not enough in the manufacture of the circuit board, it will cause the board to be warped, concave and folded, and the pressure will be easily deformed.

[0008] 2 The metal contact surface area increases, heat conduction and heat dissipation

Copper laying objects are usually generated semi-automatically in CAD Layout software. However, there are differences in the definition and description of copper surface objects by various CAD software on the design side in the market, resulting in various analysis errors when they are finally merged to the CAM software on the manufacturing end. The error cost is also determined by The board factory undertakes

[0013] It can be seen that copper surface objects have a great impact on the manufacturing yield. In the past, the analysis of copper surface objects in the industry relied on the experience of engineers and the simultaneous analysis and inspection of the other four objects, which was not efficient. The industry urgently needs professional and systematic methods for copper surface objects. analysis algorithm

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