Crystallizer copper plate quality optimization method and system based on thermal conductivity evaluation

A technology of crystallizer copper plate and thermal conductivity, applied in the field of data processing, can solve the problems of thermal conductivity influence and poor thermal conductivity, and achieve the effect of ensuring comprehensiveness, quality optimization, and normalizing data

Active Publication Date: 2022-07-05
济南东方结晶器有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The embodiment of the present application provides a method and system for optimizing the quality of mold copper plates based on thermal conductivity evaluation, which is used to solve the high requirements for the thermal conductivity of mold copper plates in the prior art. Poor thermal conductivity or too fast thermal conductivity will affect the connection The technical problems of the surface and internal quality of the slab, to achieve a reasonable evaluation of the thermal conductivity, and to optimize the quality of the mold copper plate by using the thermal conductivity requirements, thereby improving the technical effect of the quality of the slab

Method used

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  • Crystallizer copper plate quality optimization method and system based on thermal conductivity evaluation
  • Crystallizer copper plate quality optimization method and system based on thermal conductivity evaluation
  • Crystallizer copper plate quality optimization method and system based on thermal conductivity evaluation

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Embodiment 1

[0025] like figure 1 As shown, the present application provides a method for optimizing the quality of a mold copper plate based on thermal conductivity evaluation, the method comprising:

[0026] S100: Obtain the parameter information of the copper plate of the mold;

[0027] Specifically, the mold is the key tool in horizontal continuous casting, and the copper plate is the main component of the mold.

[0028] The parameter information includes parameter information such as geometric parameters, material types, and preparation processes of the crystallizer copper plate, wherein the geometric parameters include geometric parameters such as narrow-side copper plates and broad-side copper plates; the material types include red copper, phosphor copper, Cu - Cr-Zr alloy, Cu-Ag alloy and other material types; the preparation process includes the chemical composition ratio of raw materials in the preparation process, preparation process steps and corresponding preparation process ...

Embodiment 2

[0085] Based on the same inventive concept as the method for optimizing the quality of mold copper plate based on thermal conductivity evaluation in the foregoing embodiment, such as Figure 4 As shown, the present application provides a mold copper plate quality optimization system based on thermal conductivity evaluation, wherein the system includes:

[0086] The first obtaining unit 11, the first obtaining unit 11 is used to obtain the parameter information of the copper plate of the mold;

[0087] The first processing unit 12, the first processing unit 12 is configured to perform partition processing on the mold copper plate through the mold copper plate parameter information, and obtain a plurality of block parameters;

[0088] The second obtaining unit 13, the second obtaining unit 13 is configured to obtain the thermal conductivity parameter set of the mold copper plate through the plurality of block parameters;

[0089] The third obtaining unit 14, the third obtaining...

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Abstract

The invention provides a crystallizer copper plate quality optimization method and system based on heat conduction performance evaluation, and relates to the technical field of data processing, and the method comprises the steps: obtaining the parameter information of a crystallizer copper plate; according to the crystallizer copper plate parameter information, partition processing is conducted on the crystallizer copper plate, and multiple block parameters are obtained; obtaining a heat-conducting property parameter set of the crystallizer copper plate through the plurality of block parameters; first temperature information is obtained through application scene parameter information of the crystallizer copper plate; performing partition processing to obtain a first temperature information set; determining a heat-conducting property parameter test set; evaluating the heat-conducting property parameter set to obtain a heat-conducting property evaluation result; and correspondingly optimizing the quality of the crystallizer copper plate. The technical problem that the surface and internal quality of the continuous casting blank can be affected by poor heat conductivity or too fast heat conductivity is solved, and the technical effects that the heat conductivity is reasonably evaluated, the quality of the crystallizer copper plate is optimized according to the heat conductivity requirement, and then the quality of the casting blank is improved are achieved.

Description

technical field [0001] The invention relates to the technical field of data processing, in particular to a method and system for optimizing the quality of a mold copper plate based on thermal conductivity performance evaluation. Background technique [0002] The mold is the key component of the continuous casting machine, and the copper plate is the core component of the mold. The molten steel conducts heat outward through the mold steel plate to solidify the molten steel into a billet with a certain thickness. The copper plate is subjected to high and low temperatures during this process. The thermal stress caused by high temperature thermal expansion, the plastic deformation caused by high temperature thermal expansion, the huge tensile stress caused by cooling and shrinkage, and the frictional force generated by the relative movement of the billet and the copper plate, which require the copper plate of the mold to have high thermal conductivity and high resistance. Tensil...

Claims

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Application Information

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IPC IPC(8): G16C60/00G16C20/30G16C20/70G06Q10/04G06Q10/06G06Q50/04G01N25/20
CPCG16C60/00G16C20/30G16C20/70G06Q10/04G06Q10/06395G06Q50/04G01N25/20Y02P90/30
Inventor 李培忠安玉华付琦贾红
Owner 济南东方结晶器有限公司
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