Anti-dry-out temperature equalizing plate

Abstract

The invention discloses an anti-dryout uniform temperature plate which comprises an upper cover plate. The lower cover plate corresponds to the upper cover plate and is in sealing joint with the upper cover plate, and a cavity is formed between the lower cover plate and the upper cover plate; the feeding mechanism comprises a feeding pipe and a pneumatic device located in the feeding pipe, a standby working medium which is driven and extruded by the pneumatic device is contained in the feeding pipe, the top of the feeding pipe is communicated with the upper portion of the cavity, the bottom of the feeding pipe is communicated with the lower portion of the cavity, and when the pneumatic device is pressed, the pneumatic device extrudes the standby working medium; a standby working medium enters the lower portion of the cavity through the bottom of the feeding pipe. The vapor chamber can adapt to higher heat flux density, can effectively dissipate heat under the condition of overclocking operation or extreme-power-consumption operation in a short time, avoids the situation that the vapor chamber is burnt out, enables a working medium in the vapor chamber to effectively and circularly flow, avoids the situation that the vapor chamber fails, and achieves protection of the vapor chamber.

Description

technical field [0001] The invention belongs to the technical field of heat and mass transfer, and in particular relates to an anti-burning and drying temperature equalizing plate. Background technique [0002] The vapor chamber is a vacuum chamber vapor chamber. The technical principle is similar to that of a heat pipe, but there are differences in the way of conduction. The heat pipe is one-dimensional linear heat conduction, while the heat in the vacuum chamber vapor chamber is conducted on a two-dimensional surface, so the efficiency is higher. [0003] With the gradual increase in the performance of electronic equipment systems, corresponding to the increase in chip manufacturing process and the increase in chip heat flux density, the current single chip heat flux density can reach 100W / cm 2 . In the traditional design structure of the vapor chamber, the working medium is sealed by a single charge. Therefore, in the process of increasing the number of operating cores ...

AI Technical Summary

Problems solved by technology

In the traditional vapor chamber design structure, the working medium is sealed by one-time filling. Therefore, when the number of operating cores of the system host chip increases or the iterative upgrade of the chip generation, the sudden increase of single-point heat flux causes the vapor chamber to appear. The phenomenon of "burning dry", that is, the working medium inside the vapor chamber is evaporated in a short time, and cannot be effectively condensed and reflowed, resulting in the inability of the working medium to circulate effectively, which in turn leads to the failure of the vapor chamber, the chip burns, and the system downtime

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