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Preparation method of distance-controllable thermoelectric arm array

A thermoelectric arm and thermoelectric technology, applied in the manufacture/processing of thermoelectric devices, thermoelectric devices that only use the Peltier or Seebeck effect, etc., can solve the adverse effects of unified and standardized preparation, insufficient consideration of the regularity of thermoelectric arm arrangement, device failure, etc. problem, to achieve the effect of improving production efficiency and yield, controllable spacing, and regular array arrangement

Pending Publication Date: 2022-07-15
HANGZHOU INNOVATION RES INST OF BEIJING UNIV OF AERONAUTICS & ASTRONAUTICS
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  • Summary
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  • Description
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  • Application Information

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Problems solved by technology

However, this prior art does not fully consider the spacing control of adjacent thermoelectric sheets and thermoelectric arms and the regularity of the arrangement of thermoelectric arms, which will adversely affect the uniform and standardized preparation of subsequent upper / lower electrodes
However, the direct bonding of thermoelectric sheets may cause conduction between different thermoelectric arms, resulting in device failure.

Method used

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  • Preparation method of distance-controllable thermoelectric arm array
  • Preparation method of distance-controllable thermoelectric arm array
  • Preparation method of distance-controllable thermoelectric arm array

Examples

Experimental program
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preparation example Construction

[0038] The embodiment of the present invention relates to a preparation method of a thermoelectric arm array with controllable spacing, and the preparation flow chart is as follows figure 1 shown, including the following steps:

[0039] (1) Preparation of semiconductor / insulator composite block:

[0040] A mold with a cross-section matching the shape and size of the P-type and N-type thermoelectric sheets and insulating layers is used, and the cured encapsulant is pre-filled in the mold. N-type thermoelectric sheet / insulating layer...P-type thermoelectric sheet / insulating layer / N-type thermoelectric sheet are placed in the mold in sequence to ensure that the insulating layer is separated between adjacent thermoelectric sheets. The minimum arrangement repeating unit structure is as follows figure 2 a shown. After the placement is completed, an external force is applied above the mold to discharge the excess cured encapsulant. After the package is cured, the external force is...

Embodiment 1

[0054] Embodiment 1 uses cellulose film as insulating layer material, carries out spacing regulation and implementation

[0055] (1) Preparation of semiconductor / insulator composite block:

[0056] A mold with a cross-section matching the shape and size of the P-type and N-type thermoelectric sheets and insulating layers is used, and the cured encapsulant is pre-filled in the mold. N-type thermoelectric sheet / insulation layer...P-type thermoelectric sheet / insulation layer / N-type thermoelectric sheet are placed in the mold in sequence to ensure that adjacent thermoelectric sheets are separated by insulating layers. After placing, apply external force above the mold to discharge excess curing encapsulant, and cure at room temperature for 24h. After the package is cured, the external force is removed, and the mold is removed to obtain a semiconductor / insulator composite block.

[0057] The used P-type and N-type thermoelectric sheets are made of hot-pressed bismuth telluride, w...

Embodiment 2

[0061] Example 2 Preparation of semiconductor / insulator composite sheet and thermoelectric arm array

[0062] (1) Preparation of semiconductor / insulator composite block:

[0063] A mold with a cross-section matching the shape and size of the P-type and N-type thermoelectric sheets and insulating layers is used, and the cured encapsulant is pre-filled in the mold. N-type thermoelectric sheet / insulation layer...P-type thermoelectric sheet / insulation layer / N-type thermoelectric sheet are placed in the mold in sequence to ensure that adjacent thermoelectric sheets are separated by insulating layers. After placing, apply external force above the mold to discharge excess curing encapsulant, and cure at room temperature for 24h. After the package is cured, the external force is removed, and the mold is removed to obtain a semiconductor / insulator composite block.

[0064] The material of the P-type and N-type thermoelectric sheets used is bismuth telluride, the thickness is 1.1 mm, ...

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Abstract

The invention provides a preparation method of a distance-controllable thermoelectric arm array, and the method employs an integrated preparation strategy, introduces a reusable detachable-demolding mold and insulating layers, regulates the thickness and the placement number of the insulating layers, and assists in applying an external force. And carrying out spacing and alignment arrangement control on the semiconductor / insulator composite thermoelectric sheet and the thermoelectric arm array. The prepared semiconductor / insulator composite thermoelectric sheet and thermoelectric arm array is controllable in spacing and regular in array arrangement, the subsequent upper / lower electrode preparation requirements are met, meanwhile, the preparation efficiency and the yield can be improved, and a foundation is laid for mass production and industrialization of devices.

Description

technical field [0001] The invention relates to the technical field of thermoelectric device manufacturing, in particular to a preparation method of a thermoelectric arm array with controllable spacing. Background technique [0002] Under the action of a temperature difference or an applied potential, the carriers inside the thermoelectric device undergo directional migration, thereby realizing the mutual conversion between thermal energy and electrical energy, which is used for power generation or cooling. At present, commercial thermoelectric devices use bulk thermoelectric materials, and the preparation process involves the processing, arrangement, and fixation of thermoelectric arm particles. For simple thermoelectric devices, the used thermoelectric arm particles are few and larger in size, and the processes of processing, arranging and fixing are relatively easy to implement. However, when the prepared thermoelectric device contains a large number of thermoelectric ar...

Claims

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Application Information

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IPC IPC(8): H01L35/34H01L35/32
CPCH10N19/101H10N10/01
Inventor 邓元冯雪梁立兴崔长伟
Owner HANGZHOU INNOVATION RES INST OF BEIJING UNIV OF AERONAUTICS & ASTRONAUTICS
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