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Thin film deposition device and supporting mechanism thereof

A technology of thin film deposition device and support mechanism, which is applied in the direction of metal material coating process, coating, gaseous chemical plating, etc., can solve the problem of decreased uniformity of thin film deposition, and achieve the purpose of improving the uniformity of thin film deposition and improving the quality of thin film deposition , the effect of increasing production capacity

Pending Publication Date: 2022-07-22
JIANGSU MICROVIA NANO EQUIP TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] In the prior art, some PECVD thin film deposition equipment enlarge the cavity in order to increase the production capacity, but after the cavity is enlarged, the uniformity of film deposition decreases

Method used

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  • Thin film deposition device and supporting mechanism thereof
  • Thin film deposition device and supporting mechanism thereof
  • Thin film deposition device and supporting mechanism thereof

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Embodiment Construction

[0054] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, but not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative work fall within the protection scope of the present application.

[0055] It should be noted that when an element is referred to as being "disposed on" another element, it can be directly on the other element or intervening another element may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or it may be intervening with the other element. The terms "vertical", "horizontal", "left", "right" and similar expressions used here...

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PUM

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Abstract

The invention discloses a thin film deposition device and a supporting mechanism thereof, and the supporting mechanism comprises a heating plate which comprises a first surface and a second surface which are oppositely arranged; the main supporting plate is located on one side of the second surface and used for supporting the heating plate; in a first direction, the main supporting plate is provided with a first end part and a second end part which are opposite to each other, and the first direction is parallel to a contact plane of the heating plate and the carrier plate; and the auxiliary supporting plate is positioned at the first end part and the second end part, and is positioned between the heating plate and the main supporting plate. According to the thin film deposition device and the supporting mechanism thereof provided by the invention, the temperature uniformity and the electric field uniformity in the device can be improved, so that the thin film deposition uniformity is improved.

Description

technical field [0001] The present application relates to the technical field of photovoltaic production, and in particular, to a thin film deposition apparatus and a supporting mechanism thereof. Background technique [0002] The descriptions in this section merely provide background information related to the disclosure in this specification and do not constitute prior art. [0003] With the popularity of solar power generation, the demand for photovoltaic products is increasing, and the equipment requirements for manufacturing photovoltaic products are getting higher and higher. Equipment for manufacturing photovoltaic products not only needs to increase production capacity, but also the size of silicon wafers is getting larger and larger, and the requirements for cell efficiency are getting higher and higher. [0004] The theoretical efficiency of the heterojunction cell process reaches more than 28%, which is the process route with the highest theoretical efficiency at...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C16/46C23C16/513C23C16/52
CPCC23C16/513C23C16/52C23C16/46
Inventor 朱双双陈昊田玉峰
Owner JIANGSU MICROVIA NANO EQUIP TECH CO LTD
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