Heat insulation device and preparation method thereof
A heat insulation device and heat insulation layer technology, which is applied in lamination devices, chemical instruments and methods, non-polymer adhesive additives, etc., can solve the problem of airgel heat insulation layer and adhesive tape peeling off and failure of heat insulation Fixed layer, long service time, etc., to avoid the effect of reducing thermal conductivity
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Embodiment 1
[0035] One aspect of this embodiment provides a thermal insulation device, which includes a first thermal insulation layer, wherein the first thermal insulation layer is a segmented structure; and a second thermal insulation layer, the second thermal insulation layer passes through an adhesive layer Connected with the first heat insulating layer, the second heat insulating layer is used to prevent relative displacement between the sections of the first heat insulating layer; the adhesive layer is prepared from resin material, first additive and second additive The first heat insulating layer is an aerogel structure; the second heat insulating layer is made of flexible materials; the thickness of the first heat insulating layer is greater than that of the second heat insulating layer and the adhesive layer; the The thickness of the adhesive layer is 0.05mm;
[0036] The resin material is epoxy resin, the first additive is dibutyl phthalate, and the second additive is triethylen...
Embodiment 2
[0045] The same features of this embodiment and the first embodiment will not be repeated, and the different features of this embodiment and the first embodiment are:
[0046] One aspect of this embodiment provides a thermal insulation device, wherein the first additive is dibutyl phthalate, and the second additive is diethylaminopropylamine; the resin material, the first additive, and the second additive The mass ratio of mixing is 100:6:14; the thickness of the adhesive layer is 0.03mm; under the vibration condition of the frequency of 600-1000Hz, the heat insulation device lasts for 23h, the second heat insulation layer and / or the second heat insulation layer The thermal insulation layer is not separated from the adhesive layer.
[0047] Another aspect of this embodiment provides a method for preparing a thermal insulation device. After the second thermal insulation layer is wound, a release cloth is then wound on the surface of the second thermal insulation layer; the firs...
Embodiment 3
[0055] The same features of this embodiment and the first embodiment will not be repeated, and the different features of this embodiment and the first embodiment are:
[0056] One aspect of this embodiment provides a thermal insulation device, wherein the first additive is maleic anhydride, the second additive is triethylenetetramine; the resin material, the first additive, and the second additive are mixed The mass ratio is 100:4:10; the thickness of the adhesive layer is 0.01mm; the thermal conductivity of the heat insulation device is 0.029W / m·K; the heat insulation device is under vibration conditions with a frequency of 600-1000Hz , the second thermal insulation layer and / or the second thermal insulation layer is not separated from the adhesive layer for a duration of 20h.
[0057] Another aspect of this embodiment provides a method for preparing a thermal insulation device. After the second thermal insulation layer is wound, a release cloth is then wound on the surface o...
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Abstract
Description
Claims
Application Information
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