Anti-surge chip resistor and manufacturing method thereof

Abstract

The manufacturing method comprises the following steps: firstly, carrying out laser scribing on the upper surface of a ceramic substrate according to sizes corresponding to resistors of different models, and then sequentially plating a resistance layer, a barrier layer and an electrode layer on the upper surface and the lower surface of the ceramic substrate from inside to outside in a sputter coating manner; masks of corresponding specifications are designed according to resistors of different models, and resistor patterns and electrode patterns are formed on the resistor layer and the electrode layer in a photoetching mode; plating silicon dioxide protective layers on the surfaces of the resistance layer and the electrode layer through an electron beam evaporation coating process; a single-sided resistive film layer of a traditional chip thin-film resistor is changed into a double-sided resistive film layer, current passes through the upper resistive layer and the lower resistive layer, which is equivalent to a parallel circuit, and the current passing through the whole chip resistor is distributed to the two resistive layers, so that the current passing through the single resistive layer is reduced, and the current passing through the single resistive layer is reduced. Therefore, the anti-surge capability of the chip thin film resistor is improved.

Description

technical field [0001] The invention relates to the technical field of resistors, in particular to an anti-surge chip resistor and a manufacturing method thereof. Background technique [0002] In electronic design, the strong pulse generated at the moment when the power supply (mainly refers to the power supply) is just turned on, because the linearity of the circuit itself may be higher than the pulse of the power supply itself, or because the power supply or other parts of the circuit are subjected to its own or external spikes disturbances, known as surges; [0003] In the manufacturing process of the alloy chip resistor with a single-layer resistance layer structure, due to the need to adjust the resistance value, it is often necessary to etch, punch or laser burn the resistance layer into a specific resistance circuit. This process is bound to cause the resistance layer to actually pass through. The smaller the cross-sectional area of ​​the current, the smaller the pow...

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Problems solved by technology

[0003] In the manufacturing process of alloy chip resistors with a single-layer resistance layer structure, due to the need to adjust the resistance value, it is often necessary to etch, punch or laser burn the resistance layer to form a specific resistance circuit. This process will inevitably lead to the actual passage of the resistance layer. The cross-sectional area of ​​the current becomes smaller, resulting in a smaller power of the product, lowering the pulse energy level of the resistor, and resulting in a worsening of the surge resistance of the resistor;

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