Application of planar carrier plate in wafer bearing

Abstract

The invention discloses an application of a planar carrier plate in wafer bearing, and the application method specifically comprises the following steps: S1, completing the front-end process of the front surface, then bonding a glass carrier plate, then carrying out the thinning of the back surface of a wafer, and completing the front-end process of the back surface of the wafer; s2, spraying a water film on the back surface of the wafer, attaching a silicon support plate, then integrally overturning the glass support plate, the wafer and the silicon support plate, and finally removing the glass support plate by de-bonding; s3, baking to volatilize the water film, coating SOG on the edge of the wafer for plugging, and removing the adhesive to complete the back-end process of the front surface of the wafer; s4, attaching a plane carrier plate to the front surface, integrally overturning the silicon carrier plate, the wafer and the plane carrier plate, breaking the SOG through a laser ring, and removing the silicon carrier plate; and S5, carrying the wafer through the plane carrying disc to complete the subsequent wafer manufacturing process. According to the invention, the wafer is carried through the silicon carrier plate and the planar carrier plate, bonding is carried out without using an adhesive, the temperature limitation of a high-temperature process is overcome, the carrier is simple to manufacture, and the material cost is lower.

Description

technical field [0001] The invention relates to the technical field of wafer processing, in particular to the application of a plane carrier in wafer carrier. Background technique [0002] In an integrated circuit device manufacturing apparatus, a wafer carrier plays a very important role, and is generally used to hold the wafer for processing or only for temporary wafer placement. If the wafer carried by the wafer carrier is offset relative to the wafer carrier, it will cause process deviation in the subsequent process, resulting in yield loss; The circle is offset relative to the target position, which may cause the wafer to be knocked and broken. [0003] In order to facilitate loading and transporting during wafer processing, a widely used method is to use a glass carrier as a medium to mount wafers. However, using a glass carrier to carry wafers needs to be bonded with an adhesive, and the adhesive has poor high temperature resistance and cannot meet the needs of the ...

AI Technical Summary

Problems solved by technology

However, the use of glass substrates to carry wafers needs to be bonded with adhesives, and the adhesives have poor high temperature resistance and cannot meet the needs of high-temperature wafer manufacturing processes. Therefore, a new wafer mounting method is urgently needed to overcome high-temperature processes. The problem that the wafer cannot be stably limited

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