Embedded structure and manufacturing method of filter module

A filter and module technology, applied in impedance networks, electrical components, etc., can solve problems such as product deformation, hidden dangers of reliability, insufficient epoxy resin filling, etc., to save costs and improve reliability.

Pending Publication Date: 2022-07-29
SHANGHAI PINGSHENG MICRO CORP
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  • Abstract
  • Description
  • Claims
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Problems solved by technology

[0014] In order to solve the existing problems in the existing technology, this solution changes the package of all devices in the filter module to a partial package and a part of the substrate embedded, which solves the problem of fully filling the gap between the filter cavity film and the copper pillar of the flip-chip switch chip. The conflict problem solves the problem of filling the gap bet

Method used

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  • Embedded structure and manufacturing method of filter module
  • Embedded structure and manufacturing method of filter module
  • Embedded structure and manufacturing method of filter module

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Embodiment Construction

[0101] The specific embodiments of the present invention will be described in more detail below with reference to the schematic diagrams. The advantages and features of the present invention will become more apparent from the following description and the scope of the patent application. It should be noted that, the accompanying drawings are all in a very simplified form and in an inaccurate scale, and are only used to facilitate and clearly assist the purpose of explaining the embodiments of the present invention.

[0102] see figure 1 , A filter module according to the first embodiment of the present invention has a substrate 6, the front surface of the substrate 6 is a PiP structure, and the filter package body 1 is attached to the front surface of the substrate 6 after a plurality of packages and is packaged with a module plastic sealing layer 2, and the switch chip is sealed. 8 and the inductive passive element 10 are placed inside the substrate. The filter package 1 i...

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Abstract

According to the embedded structure of the filter module, full device packaging in the filter module is changed into partial packaging and partial substrate embedding, so that the conflict problem of full filling of a filter cavity covering film and a copper column gap of a flip switch chip is solved, and the problem of gap filling between two poles of an inductance passive element is solved; the problem of reliability hidden danger caused by extremely reduced size of a filter packaging body is solved, the hidden danger of product deformation and failure caused by unbalanced internal stress of various different materials in full-device packaging is solved, and the problems of dense components, small gaps and insufficient epoxy resin filling are solved. Meanwhile, different packaging schemes of the filter can be selected, so that the cost control of a scheme using a high-cost special film coating material can be effectively reduced.

Description

technical field [0001] The present invention relates to the technical field of semiconductor radio frequency, in particular to a signal receiving end filter module integrated device. Background technique [0002] Current package structure: [0003] The first type: PiP (Package in Package) module device encapsulates filter plastic encapsulated device [0004] The common shape is LGA (Land Grid Array) grid array package. The internal plane structure is to mount all components on the substrate (component carrier). The arrangement components include: multiple filter packages, a flip-chip switch chip, Multiple inductive passive components, etc. The filter package and the module substrate are connected with tin solder, and the gaps of the components are filled with epoxy resin, which plays the role of circuit isolation and protection. [0005] The common structure of the filter package is that a filter chip is flipped on the substrate, and a layer of isolation film is pasted on...

Claims

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Application Information

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IPC IPC(8): H03H1/00H03H3/00
CPCH03H1/00H03H3/00H03H2001/0021
Inventor 吴现伟汪洋朱斌
Owner SHANGHAI PINGSHENG MICRO CORP
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