Circuit-embedded PCB manufacturing method and circuit-embedded PCB

Abstract

The invention discloses a circuit-embedded PCB manufacturing method and a circuit-embedded PCB, and relates to the technical field of circuit board manufacturing. According to the manufacturing method of the PCB with the embedded circuit, the circuit assembly serves as an independent unit, the containing groove is formed in the first core board subjected to brownification treatment, and then the containing groove and the adhesive tape are used for fixing the circuit assembly, so that the circuit assembly is prevented from deviating during lamination, and the manufacturing precision of the PCB is improved. Finally, the leads are electrically connected with all layers of circuits of the multilayer board, so that the circuit assembly is electrically connected with all layers of circuits, the PCB with the embedded circuits is generated, the problem that machining tolerance occurs in the circuit etching machining process of an existing PCB is solved, the problem that the surface roughness of the circuits is increased due to the fact that the circuit assembly is subjected to browning treatment is solved, and the production efficiency is improved. Therefore, the insertion loss performance of the PCB is ensured to meet the signal transmission requirement.

Description

technical field [0001] The invention relates to the technical field of circuit board fabrication, in particular to a PCB fabrication method with embedded circuits and a PCB with embedded circuits. Background technique [0002] In recent years, with the continuous development of electronic products, higher requirements have been placed on the integrity of signal transmission. The more complete the signal transmission, the smaller the loss of the signal during the transmission process. Therefore, the insertion loss performance of the PCB (Printed Circuit Board, printed circuit board) is very important to whether the PCB meets the signal transmission requirements. [0003] The circuit of the existing PCB is mainly fabricated by circuit etching on the metal layer, so as to realize the circuit production of the PCB. However, in the process of PCB production in the traditional way, in order to improve the bonding force of the lamination process, it is necessary to carry out brown...

AI Technical Summary

Problems solved by technology

[0005] The object of the present invention is to provide a PCB manufacturing method for buried circuits and a PCB for buried circuits, which can solve the problem of tolerances in the circuit etching process of existing PCBs, and avoid the problems caused by the browning treatment of the circuits. The problem of increasing the surface roughness of the circuit, so as to ensure that the insertion loss performance of the PCB meets the signal transmission requirements

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