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Method for reducing printing ink black spot pollution on copper surface

A technology of copper surface and black spots, which is applied in chemical/electrolytic methods to remove conductive materials, printed circuits, electrical components, etc., can solve problems such as black spot pollution, reduce scrap, efficiently remove residual glue and ink particles, The effect of improving economic efficiency

Active Publication Date: 2022-08-09
安捷利美维电子(厦门)有限责任公司 +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In order to overcome the deficiencies of the prior art, the object of the present invention is to provide a method for reducing ink black spot pollution on the copper surface, more efficiently detach the residual glue and ink particles, solve the problem of black spot pollution on the copper surface, and reduce copper surface pollution to the greatest extent. The scrapping of foreign matter with black spots on the surface improves economic benefits

Method used

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  • Method for reducing printing ink black spot pollution on copper surface
  • Method for reducing printing ink black spot pollution on copper surface
  • Method for reducing printing ink black spot pollution on copper surface

Examples

Experimental program
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Embodiment 1

[0063] This embodiment provides a method for reducing black spot pollution of copper surface ink, which includes the following steps in sequence: a step of developing, etching, and film removal of an outer layer of a copper surface, a step of automatic optical detection, a step of polishing aluminum oxide, and processing of aluminum oxide polishing. , screen printing, pre-baking, exposing, developing, post-baking and UV curing, alkaline washing, micro-etching, sandblasting and immersion nickel gold.

Embodiment 2

[0065] This embodiment provides a method for reducing black spot contamination of copper surface ink, which sequentially includes the following steps: a step of developing and etching an outer layer of the copper surface to remove the film, a step of automatic optical detection, a step of removing the outer layer, and a step of aluminum oxide grinding plate treatment. Steps, screen printing steps, pre-baking steps, exposure steps, development steps, post-baking and UV curing steps, alkaline washing sections, micro-etching sections, sandblasting steps and immersion nickel gold steps.

Embodiment 3

[0067] This embodiment provides a method for reducing black spot pollution of copper surface ink, which includes the following steps in sequence: a step of developing, etching, and film removal of an outer layer of a copper surface, a step of automatic optical detection, a step of polishing aluminum oxide, and processing of aluminum oxide polishing. , screen printing, pre-baking, exposure, developing, post-baking and UV curing, alkaline washing, sandblasting and immersion nickel gold.

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PUM

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Abstract

The invention discloses a method for reducing copper surface ink black spot pollution, and relates to the technical field of solder resist ink. Comprising the steps of copper surface outer layer developing, etching and film stripping, automatic optical detection, aluminum oxide grinding plate pretreatment, aluminum oxide grinding plate treatment, screen printing, pre-baking, exposure, developing, post-baking and UV curing, copper surface black spot cleaning, sand blasting and nickel and gold immersion. The method includes the steps of copper surface outer layer developing, etching and film stripping, automatic optical detection, aluminum oxide grinding plate pretreatment, aluminum oxide grinding plate treatment, screen printing, pre-baking, exposure, developing, post-baking and UV curing, copper surface black spot cleaning, sand blasting and nickel and gold immersion. According to the method for reducing copper surface printing ink black spot pollution, residual glue and printing ink particles are more efficiently removed, the problem of copper surface black spot pollution is solved, scrap of copper surface black spot foreign matter is reduced to the maximum extent, and economic benefits are improved.

Description

technical field [0001] The invention belongs to the technical field of solder resist ink, and in particular relates to a method for reducing black spot pollution of copper surface ink. Background technique [0002] In the PCB printed circuit board industry, micro-etching of alumina grinding plate will be added in the pre-treatment of solder mask, and the copper surface will be roughened and etched to improve the bonding force between solder mask ink and copper surface and the effect of surface treatment. Anti-attack performance. However, most of the existing solder mask development lines are horizontal production lines. Because the copper front treatment method is micro-etching of alumina grinding plate, the copper surface is relatively rough, and most of the inks in the development process are in the form of small particles. , off the board surface, but because the ink is in the form of small particles, it is easy to stick back to the roller sheet in direct contact. With t...

Claims

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Application Information

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IPC IPC(8): H05K3/06H05K3/00H05K3/12
CPCH05K3/061H05K3/0017H05K3/0055H05K3/12
Inventor 何锦添梁俊业林杰斌
Owner 安捷利美维电子(厦门)有限责任公司