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Non-lead solder powder, non-lead solder paste and its prepn. method

A technology of lead-free solder and powder, which is applied in the field of preparing the solder powder and solder paste, lead-free solder paste, low-melting point high-quality lead-free solder powder, and can solve unavoidable problems

Inactive Publication Date: 2004-08-11
ULTRATECH INT INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Therefore, the aforementioned disadvantages caused by lead cannot be avoided

Method used

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  • Non-lead solder powder, non-lead solder paste and its prepn. method
  • Non-lead solder powder, non-lead solder paste and its prepn. method
  • Non-lead solder powder, non-lead solder paste and its prepn. method

Examples

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Embodiment 1

[0037] use figure 2 The shown equipment is used to produce the lead-free solder of the present invention. 36 g of stainless steel balls with a diameter of 3 / 8 inch and metal powder with an average particle size of 0.5 mm were placed in container 12 . The metal powder consisted of Sn, Ag and Cu in a weight ratio of 95.7:3.5:0.8. A few drops of methanol were then added with a dropper to prevent the metal powder from adhering to the vessel and metal sphere walls. Then, argon gas was filled in the container to prevent the metal powder from being oxidized, and then the container was sealed.

[0038] use figure 2 A vibratory ball mill apparatus (Super Misumi NEV-MA8, product of Nisshin Giken) as shown milled the material powder at a frequency of 13.1 Hz for 5 hours. The metal powder obtained was then analyzed with a DSC7 (Perkin Elmer) to determine the onset point of melting while increasing the temperature from 150°C to 250°C at a rate of 10°C per minute. The measured point ...

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Abstract

The invention provides a lead-free solder metal powder with perfect performance, a lead-free solder paste, and a process for preparing the powder and paste. The lead-free solder metal powder material including two or more metals capable of forming an intermetallic compound and having an unreacted phase and an amorphous phase. The powder material is preferably formed using a mechanical milling process. Further, a lead-free solder paste is prepared by mixing the powder material with a soldering flux.

Description

technical field [0001] The present invention relates to a lead-free solder powder, a lead-free solder paste, and a method for preparing them. In more detail, the present invention relates to a low-melting point high-quality lead-free solder powder having good wettability, a solder paste including the solder powder, and a method for preparing the solder powder and the solder paste. Background technique [0002] Metallic lead (Pb) is included in common solder alloys. Therefore, there is concern about the effect on workers of toxic gases generated by melting solder during the brazing process. Further, recently more and more fabrication processes of microelectronic devices include soldering. Lead washed from discarded IC chips or printed wiring boards contaminates ground water, which in turn causes environmental problems including lead poisoning or the like. [0003] Several lead-free solders are now being developed. However, they are difficult to use in practice due to thei...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B02C17/04B22F1/00B22F9/02B23K35/00B23K35/02B23K35/26B23K35/30B23K35/40H05K3/34
CPCB23K35/025B23K35/30H05K3/3484B23K35/26B23K35/0244H05K3/3485B23K35/00
Inventor 庄司郁夫
Owner ULTRATECH INT INC