Leadfree SnZn-base alloy solder containing rare-earth elements
A technology of rare earth elements and lead-free solder, which is applied in metal processing equipment, welding/cutting media/materials, welding media, etc., can solve the problem of poor wettability and corrosion resistance of alloys, low bonding strength of brazed joints, and insufficient effect Remarkable and other problems, to achieve the effect of suitable melting point, excellent tissue stability and high bonding strength
A technology of rare earth elements and lead-free solder, which is applied in metal processing equipment, welding/cutting media/materials, welding media, etc., can solve the problem of poor wettability and corrosion resistance of alloys, low bonding strength of brazed joints, and insufficient effect Remarkable and other problems, to achieve the effect of suitable melting point, excellent tissue stability and high bonding strength
CN1175956CInactive Publication Date: 2004-11-17DALIAN UNIV OF TECH
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[0023] The following chemical composition (%) is selected: (7-9) Zn; (0.05-0.15) RE; (0.5-3) Bi; (0.2-0.5) Al, and the balance is Sn. The above-mentioned raw materials prepared according to the composition are put into an industrial vacuum induction furnace for smelting, under normal pressure, the temperature is kept at 500°C for 4-6 hours, and the solder alloy can be obtained by pouring, and the brazing powder is prepared by spraying, and the brazing flux is added , the solder paste is obtained. Can be used for reflow soldering.
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Abstract
A lead-free alloy as solder contains Zn (5-10 wt.%), the rare-earth elements chosen from La, Ce, Pr and Nd (0.05-1), one or more of Bi (0.1-6), Cu (0.1-3), In (0.5-3), Al (0.1-1), Ni (0.01-1) and P (0.001-1), and Sn (rest). Its advantages are better wettability, fine structure, excellent mechanical performance, low cost and no poison and pollution.
Description
technical field [0001] The invention belongs to the field of metal materials, relates to the technical field of electronic packaging brazing materials, and in particular relates to a lead-free solder alloy suitable for brazing electronic components without causing thermal damage. technical background [0002] Since the traditional tin-lead solder contains lead element which is extremely harmful to the human body and the environment, the development of lead-free solder has become an urgent task for current materials scientists. The United States, Japan and other countries are actively enacting laws to prohibit the use of lead. According to the European Union’s directive on waste of electrical and electronic products and machinery, it will completely prohibit the use of toxic and harmful elements such as lead and cadmium in the electronics industry from January 1, 2008. use in . Therefore, in order to eliminate lead pollution, there is an urgent need for lead-free solder to r...
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Patent Timeline
17 Nov 2004
Publication
CN1175956C
- IPC
- B23K35/26; C22C13/00
- Inventors
- 赵杰; 黄明亮