Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Leadfree SnZn-base alloy solder containing rare-earth elements

A technology of rare earth elements and lead-free solder, which is applied in metal processing equipment, welding/cutting media/materials, welding media, etc., can solve the problem of poor wettability and corrosion resistance of alloys, low bonding strength of brazed joints, and insufficient effect Remarkable and other problems, to achieve the effect of suitable melting point, excellent tissue stability and high bonding strength

Inactive Publication Date: 2004-11-17
DALIAN UNIV OF TECH
View PDF0 Cites 2 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, Zn element has flexible chemical properties and metallurgical properties, which makes the alloy have poor wettability and corrosion resistance, which greatly affects the application.
In recent years, in order to improve the performance of Sn-9Zn alloy, researchers have added In, Bi, Al and other elements as alloying elements to the alloy, but the effect is not significant enough
Moreover, the Sn-9Zn alloy structure contains coarse β-Sn grains, and the bonding strength of the brazed joint is also low due to poor wettability

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Leadfree SnZn-base alloy solder containing rare-earth elements
  • Leadfree SnZn-base alloy solder containing rare-earth elements
  • Leadfree SnZn-base alloy solder containing rare-earth elements

Examples

Experimental program
Comparison scheme
Effect test

Embodiment approach

[0023] The following chemical composition (%) is selected: (7-9) Zn; (0.05-0.15) RE; (0.5-3) Bi; (0.2-0.5) Al, and the balance is Sn. The above-mentioned raw materials prepared according to the composition are put into an industrial vacuum induction furnace for smelting, under normal pressure, the temperature is kept at 500°C for 4-6 hours, and the solder alloy can be obtained by pouring, and the brazing powder is prepared by spraying, and the brazing flux is added , the solder paste is obtained. Can be used for reflow soldering.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
tensile strengthaaaaaaaaaa
Login to View More

Abstract

A lead-free alloy as solder contains Zn (5-10 wt.%), the rare-earth elements chosen from La, Ce, Pr and Nd (0.05-1), one or more of Bi (0.1-6), Cu (0.1-3), In (0.5-3), Al (0.1-1), Ni (0.01-1) and P (0.001-1), and Sn (rest). Its advantages are better wettability, fine structure, excellent mechanical performance, low cost and no poison and pollution.

Description

technical field [0001] The invention belongs to the field of metal materials, relates to the technical field of electronic packaging brazing materials, and in particular relates to a lead-free solder alloy suitable for brazing electronic components without causing thermal damage. technical background [0002] Since the traditional tin-lead solder contains lead element which is extremely harmful to the human body and the environment, the development of lead-free solder has become an urgent task for current materials scientists. The United States, Japan and other countries are actively enacting laws to prohibit the use of lead. According to the European Union’s directive on waste of electrical and electronic products and machinery, it will completely prohibit the use of toxic and harmful elements such as lead and cadmium in the electronics industry from January 1, 2008. use in . Therefore, in order to eliminate lead pollution, there is an urgent need for lead-free solder to r...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): B23K35/26C22C13/00
Inventor 赵杰黄明亮于大全王来
Owner DALIAN UNIV OF TECH
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com