Method for plasma incision of matter with a specifically tuned radiofrequency electromagnetic field generator
Patent Information
- Authority / Receiving Office
- CN · China
- Current Assignee / Owner
- 理查德・J・富戈
- Publication Date
- 2004-11-24
- Estimated Expiration
- Not applicable · inactive patent
Abstract
Description
technical field
[0001] The present invention relates to a method of cutting an object with a tuned plasma cloud, in particular a tuned plasma cloud induced and maintained by electromagnetic energy waves emitted by a radio frequency signal generator system with the atomic particles constituting the tuned plasma cloud Impedance matched, frequency matched, and power matched, the tuned plasma cloud covers the excited emitter cutting probe. Background technique
[0002] Most cuts are made with solid, hard tools such as steel, sapphire, diamond, etc. These cuts are all carried out by the abrasive physical action of the sharp edge of the hard object on the surface of the cut object. These purely physical methods of trying to cut one hard object through another are inefficient, and are therefore inefficient when the object being cut encounters significant resistance when it is extremely solid and dense. Therefore, other methods resort to electrogenic cutting, electrocutting, or el...