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Method and apparatus for deposition on and polishing of semiconductor surface

A technology for depositing and polishing pads, which is applied in semiconductor devices, semiconductor/solid-state device manufacturing, semiconductor/solid-state device components, etc., to achieve the effects of large manufacturing wafer output capacity, elimination of time delay, and efficient planarization

Inactive Publication Date: 2005-01-05
NXP BV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In addition to the difficulties of CMP itself, post-CMP cleaning to remove defects and contamination from the copper film and surrounding insulating film is also challenging

Method used

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  • Method and apparatus for deposition on and polishing of semiconductor surface
  • Method and apparatus for deposition on and polishing of semiconductor surface
  • Method and apparatus for deposition on and polishing of semiconductor surface

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Embodiment Construction

[0018] Preferred embodiments of the coating deposition polishing system and method of the present invention will be described below with reference to the accompanying drawings. While the invention has been described in connection with preferred embodiments, it should be understood that the invention is not limited to these preferred embodiments. On the contrary, the present invention is intended to cover all changes and modifications within the spirit and scope of the present invention as defined by the appended claims. Furthermore, in the following detailed description of the invention, several specific details are set forth to facilitate an understanding of the invention. It will be apparent, however, to one skilled in the art that the present invention may be practiced without these specific details. In other instances, well-known methods, procedures, components and circuits have not been described in detail so as not to obscure the present invention.

[0019] The systems...

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PUM

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Abstract

The present invention system and method facilitates efficient material deposition and wafer planarization during IC wafer fabrication. The present invention is particularly useful in facilitating efficient copper deposition and manufacturing of interconnections between components of an IC. A deposition polishing system and method of the present invention performs copper deposition and polishing concurrently. One embodiment of a deposition polishing system comprises a wafer holder, polishing pad component, and CMP plating bath. The CMP plating bath is a container for holding solutions utilized in plating processes (e.g., electroplating, electroless plating, etc.) to deposit metallic material (e.g., copper) on a wafer. A wafer is placed in the plating bath containing plating solution and while metallic material is being deposited on the wafer the polishing pad component impedes deposition of material on portions of the wafer surface while facilitating deposition in other desired locations of the wafer surface (e.g., an interconnection trench). The polishing pad component also facilitates transportation of the plating solution to the wafer and the motion of the polishing pad component agitates the plating solution.

Description

technical field [0001] The present invention relates to the field of integrated circuit (IC) fabrication. More specifically, the present invention relates to systems and methods for copper deposition on IC wafers. Background technique [0002] Electronic systems and circuits have made significant contributions to the development of modern society and are used in many fields to obtain favorable results. A wide variety of electronic technologies such as digital computers, calculators, audio devices, video equipment, and telephone systems include processors that help increase productivity and reduce productivity when analyzing and processing data, ideas, and trends in business, science, education, and entertainment. cost. Typically, electronic systems designed to provide these results include integrated circuits (ICs) on wafers with metal components such as copper interconnects between elements of the IC. Often these metal components are important to the function of the IC, ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B24B37/04C25D5/22C25D7/12C25D21/10H01L21/288H01L21/304H01L21/3205H01L21/321H01L21/768H01L23/52
CPCC25D5/22C25D17/001H01L21/3212H01L21/2885H01L21/7684C25D7/12B24B37/04H01L21/288H01L21/76843H01L21/76873H01L21/76879
Inventor L·张
Owner NXP BV