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Manufacture of head universal joint assembly and device for cutting ball bonding connection

A manufacturing method and universal joint technology are applied in the installation/connection of the transducing head relative to the arm parts, the configuration/installation of the recording head, the electrical connection between the arm and the arm frame, etc., which can solve the problem of high manufacturing cost The high proportion of HGA and the increase of average manufacturing cost of HGA

Inactive Publication Date: 2005-11-30
TDK CORPARATION
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] However, the wireless suspension mount itself is expensive compared with general suspension mounts, therefore, the ratio of the manufacturing cost of the wireless suspension mount to the total manufacturing cost of the HGA with the wireless suspension mount is very high
[0008] Thus, if all HGAs considered to be electrically poor at final inspection were discarded, the average manufacturing cost of HGAs would increase significantly

Method used

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  • Manufacture of head universal joint assembly and device for cutting ball bonding connection
  • Manufacture of head universal joint assembly and device for cutting ball bonding connection
  • Manufacture of head universal joint assembly and device for cutting ball bonding connection

Examples

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Embodiment Construction

[0029] A method of manufacturing an HGA in a preferred embodiment according to the present invention will be described below with reference to FIG. 1. FIG.

[0030] First, the HGA is assembled according to a conventional manufacturing method (step S1). That is, by fixing the magnetic head slider having the thin-film magnetic head element on the top end portion of the wireless suspension by using an adhesive such as epoxy resin adhesive, and then using GBB to connect the connection soldering of the terminal electrode of the slider and the lead conductor pattern of the suspension. The pads are electrically connected, thereby assembling the HGA. An IC chip having a head driving circuit and a read signal amplifier circuit may be mounted on the lead conductor pattern extending backward from the suspension.

[0031] Then, a final inspection is performed using a DP tester to check whether the thin film magnetic head element has the required electrical properties (step S2). Products...

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Abstract

A magnetic head slider with at least one thin-film magnetic head element on a suspension is mounted. This mounting includes electrically connecting the magnetic head slider with the suspension with ball bonding connections. Electrical property of the thin-film magnetic head element is inspected, and then the ball bonding connections are separated when it is judged that the thin-film magnetic head element has defective electrical property. Then, the magnetic head slider is detached from the suspension, and thereafter a new magnetic head slider with at least one thin-film magnetic head element is mounted on the suspension from which the magnetic head slider was detached.

Description

technical field [0001] The present invention relates to a method of manufacturing a head gimbal assembly (HGA) equipped with at least one thin film head element such as used in a hard disk drive unit (HDD) and a device for cutting ball-bonded connections during the manufacture of the HGA. Background technique [0002] In an HDD, generally, thin-film magnetic head elements for reading and writing magnetic information from a magnetic disk are formed on a magnetic head slider that flies over a rotating magnetic disk during operation. [0003] Each HGA is assembled by installing the head slider on a suspension, and then electrically connecting the connection pads of the lead conductors to the terminal electrodes of the head slider, respectively. [0004] After the HGAs are thus assembled, all the assembled HGAs are subjected to a final inspection using a dynamic performance (DP) tester in order to determine whether each thin film magnetic head element has the required electrical...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G11B5/60G11B5/48G11B21/21
CPCG11B5/4853G11B5/4826Y10T29/49023Y10T29/49718Y10T29/53265Y10T29/49036Y10T29/49726Y10T29/49027Y10T29/53309Y10T29/49032Y10T29/53165Y10T29/4975Y10T29/4903Y10T29/4973
Inventor 上釜健宏白石一雅
Owner TDK CORPARATION
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