Method for contruction of two-dimension ordered distributing silicon quantum point figurated nano structure

A technology of silicon quantum dots and nanostructures, which is applied in the field of patterned nanostructures of high-density silicon quantum dots, can solve the problems of controllability of nanometer quantum dots size and difficulty in patterning distribution order, and achieve strong controllability Effect

CN1242454CInactive Publication Date: 2006-02-15NANJING UNIV
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Publication Date
2006-02-15
Estimated Expiration
Not applicable · inactive patent

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Abstract

A method for building two-dimension orderly distributed Si quantum spot graphic nanameter structure is to process a phase-shift grating form board on the film of a-Si or a-SiNx: H / a-Si: H / a-SiNx: H then to crystallize it by laser interference, the laser beam arrives at surfaces of a-Si film or a-SiNx: H / a-Si: H / a -SiNx: H via the form board to form beam spots of two dimension periodic distribution of the energy density to make a -Si: H film to realize localized crystallization, that is to form nanometer Si quantum spot array of two-dimension space orderly distributed in the film.
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Description

1. Technical field:

[0001] The present invention proposes a new technique for constructing a two-dimensional spatial orderly distributed high-density silicon quantum dot patterned nanostructure by using an excimer ultrashort pulse laser interference crystallization method from two aspects of technical principle and implementation process. The patterned and orderly distributed nano-silicon quantum dot film provided by this technology is a key material in the research of new-generation nano-electronics and nano-optoelectronic devices and other high-tech fields. 2. Background technology:

[0002] The integration of nanoelectronics and optoelectronics based on semiconductor quantum structures is the core of the new generation of semiconductor devices in the 21st century and the hardware foundation of modern information technology. Semiconductor silicon (Si) is currently the most important material for preparing microelectronic devices. However, whether Si can continue to play an...

Examples

Embodiment Construction

[0024] 1. Preparation of ultra-thin amorphous silicon (a-Si) film: a-Si:H film was prepared by plasma enhanced chemical vapor deposition (PECVD). The thickness of the a-Si:H layer can be precisely controlled in the range of 1.0-10nm; the size of the quantum dots to be obtained after laser crystallization is basically consistent with the thickness of the a-Si:H layer. Similarly, we can also prepare (a-SiN X :H / a-Si:H / a-SiN X :H) Three-layer sandwich structure, which has a wider application in nanoelectronic devices.

[0025] a-Si:H film and a-SiN X :H / a-Si:H / a-SiN X :H Preparation of three-layer sandwich structure film:

[0026] Using computer-controlled plasma-enhanced chemical vapor deposition (PECVD) technology, using silane (SiH 4 ), ammonia (NH 3 ) and argon (Ar) as the reaction gas source; deposit a-Si:H film or a-SiN on single crystal silicon wafer and double-throw fused quartz or optical glass substrate X :H / a-Si:H / a-SiN X :H three-layer structure film. Concret...