Blanching pattern mark carbon band
A technology of hot stamping and carbon ribbon, applied in the direction of temperature recording method, etc., to achieve the effect of good adhesion and wide adaptability
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Examples
example 1
[0008] Example 1 The base material is polypropylene with a thickness of 12 μm
[0009] polyamide resin
[0010] Wherein the present embodiment of polyamide resin selects the P-1155 of Lauter Company, modified rosin resin can adopt 210 of Suichuan resin, polyethylene wax can select BASF's LumaxAL3 for use, filler can select superfine calcium carbonate and lithopone for use, pigment That is, the carbon black is Cabet 800 from Cabot Company, the dispersant is BYK K-163, the leveling agent is Dow Corning 5T, and the solvent is 70% xylene and 30% isopropanol by weight. According to the above formula, heat and dissolve the resin in the solvent first, then add other components according to the order of the above formula, disperse the system uniformly through a grinder, and the particle size is below 10 μm, and coat it on the auxiliary coating by a coater. Dry at a temperature of 40°C, and form a hot stamping marking ribbon with a thickness of 10μm.
[0011] epoxy ...
example 2
[0013] Example 2 base material is polypropylene, and thickness is 10 μ m;
[0014] epoxy resin
[0015] The materials used are the same as in Example 1. According to the above formula, the resin is dissolved in the solvent by heating and stirring to make a uniform and transparent solution, and it can be coated into a film with a thickness of 1 μm by a coating machine and dried at 45°C.
[0016] polyamide resin
[0017] The materials used are the same as in Example 1. According to the above formula, the resin is heated and dissolved in the solvent first, and then other components are added in order. The uniform particle size of the system is dispersed by a grinder below 10 μm, and the auxiliary coating is coated by a coater. On the layer, dry at a temperature of 60 ℃, and its thickness is 14 μm, forming a hot stamping marking ribbon.
Embodiment 3
[0018] Embodiment 3 base material is polypropylene, and thickness is 12 μ m;
[0019] polyamide resin
[0020] epoxy resin
PUM
| Property | Measurement | Unit |
|---|---|---|
| thickness | aaaaa | aaaaa |
| thickness | aaaaa | aaaaa |
| softening point | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
Login to View More