Photosensitive resin composition and applications thereof
A technology of photosensitive resin and photosensitive resin layer, which is applied in the field of photosensitive resin composition, and can solve the problems of insufficient sensitivity of photosensitive resin composition, poor production efficiency, long peeling time of cured resist, etc.
Inactive Publication Date: 2006-09-06
ASAHI KASEI KK
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Problems solved by technology
For this reason, Japanese Patent Publication No. 1-5691 discloses a curing resist technology using a photopolymerizable monomer of a bisphenol A skeleton, but the stripping time of the curing resist is long and the production efficiency is poor.
In addition, Japanese Patent Laid-Open No. 2001-154349 discloses a cured resist technology using a photopolymerizable monomer having a bisphenol A skeleton and a phenolic mono(meth)acrylate monomer, but the adhesiveness is insufficient.
[0005] In addition, in recent years, there has been a strong demand to increase productivity by shortening the exposure time, but sufficient sensitivity cannot be obtained with conventional photosensitive resin compositions.
[0006] However, when the sensitivity is increased, the photosensitive resin composition after development remains on the copper-clad laminate and forms a very thin film. As a result, the copper surface turns red, and at the same time, there are problems such as plating streaks in the subsequent plating process.
Method used
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Embodiment 1-7
[0151] Embodiment 1-7 and comparative example 1-5
[0152] Using the photosensitive resin composition in Table 1, a photosensitive resin laminate was produced by the method described in the above 1) Substrate preparation column. In Table 1, the amounts of B-1 and 2 are represented by the solid weight of the thermoplastic polymer binder excluding the solvent. Table 1 shows the evaluation results of 2) sensitivity-6) stability after compounding of this photosensitive resin laminate.
[0153] Example 1
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Abstract
A photosensitive resin composition comprising a a thermoplastic polymeric binder having an acid equivalent of 200 to 500 and a weight-average molecular weight of 30,000 to 400,000, b a mixture of photopolymerizable monomers each bearing at least one polymerizable ethylenically unsaturated group in the molecule which comprises b1 a bisphenol-type photo- polymerizable monomer and b2 a phenol-type photopolymerizable monomer and / or a urethane-type photopolymerizable monomer, c a photopolymerization initiator, and d Color Index Basic Green 1 C.I. Basic Green 1.
Description
technical field [0001] The present invention relates to a photosensitive resin composition, a photosensitive resin laminate using the composition, and a method for producing a printed wiring board, a lead frame, or a semiconductor package using the photosensitive resin laminate. Background technique [0002] When producing a printed wiring board or the like, a photosensitive resin layer laminate made of a photosensitive resin composition is used. The photosensitive resin laminate is, for example, first coated with a photosensitive resin composition on a support such as light-transmitting polyester and then dried, and then compounded with a protective film such as polyethylene on the dried photosensitive resin laminate. manufacture. The formation of the circuit generally adopts the following method: first, after peeling off the protective film, the photosensitive resin composition layer is hot-pressed on the surface of the substrate to be formed with the desired pattern, and...
Claims
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IPC IPC(8): G03F7/027G03F7/004H05K3/00
CPCG03F7/027
Inventor 森彻足立辉彦
Owner ASAHI KASEI KK