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Laser milling method and system therfor

A laser milling and laser technology, applied in laser welding equipment, printing, electrical components, etc., can solve the problem of maintaining laser sources

Inactive Publication Date: 2007-01-17
PANASONIC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Yet another ongoing problem with micromachining involves maintaining a constant exposure of the laser source to the workpiece as the toolpath changes

Method used

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  • Laser milling method and system therfor
  • Laser milling method and system therfor
  • Laser milling method and system therfor

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Embodiment Construction

[0020] The following descriptions of preferred embodiments are merely exemplary in nature and are in no way intended to limit the invention and its application or uses.

[0021] The present invention is a method of milling using a constant toolpath algorithm (or "milling algorithm") that can be used to produce holes in a consistent, repeatable process. Furthermore, this machining process can be used to machine multiple milled holes in parallel at the same time.

[0022] As mentioned above, the approximation algorithm is relatively successful because it can produce the desired hole with constant angular velocity and tool pitch. Also as mentioned above, this process cannot compensate for the spacing of the exposed segments produced near the center of the hole.

[0023] refer to figure 1 , the constant angular velocity toolpath (toolpath) 100 includes an initial voltage (V max ) 110, a plurality of laser exposure segments 120 and a pitch 130 of the cutter pitch. With this app...

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PUM

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Abstract

A method of creating a milled structure in a fixed material using a moving laser beam is disclosed, where a picosecond laser provides short pulses of light energy to produce required exposure steps, where a variable rate of laser beam movement conducts the milling upon the material, where the laser beam tool path directs the milling process to produce a milled hole of high quality and repeatability, and where the knowledge of how to measure these 3 quantities is returned as feedback into the laser system. The present invention is further embodied as a spiral milled tool path structured to achieve the customer specified tapered hole shape. The constant arc speed tool path is required to produce tapered holes to customer specification.

Description

technical field [0001] The present invention relates to material ablation using pulsed light sources, in particular to laser drilling and laser milling. Background technique [0002] Material ablation by pulsed light sources has been studied since the invention of the laser. A 1982 report of polymers etched using ultraviolet (UV) excimer laser radiation stimulated extensive research into micromachining methods. Since then, scientific and industrial research in this field has been advancing rapidly, mainly due to the ability to use lasers to drill, mill and replicate very small parts. [0003] Ultrafast lasers generate from approximately 10 -11 seconds (10 picoseconds) to 10 -14 Intense laser pulses with a duration of 10 femtoseconds. Short-pulse lasers generate from approximately 10 -10 seconds (100 picoseconds) to 10 -11 Intense laser pulses with a duration of seconds (10 picoseconds). Various potential applications of ultrafast lasers in medicine, chemistry and comm...

Claims

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Application Information

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IPC IPC(8): B23K26/00B41J2/135B23K26/06B23K26/067B23K26/08B23K26/36B23K26/38B41J2/16G05B19/416H05K3/00
CPCB23K26/0635B23K2203/04H05K3/0026B41J2/1634B23K26/388B23K26/4005B23K26/383B41J2/162B23K26/08B23K26/0807B23K26/386B23K26/4025B23K26/0608B23K26/0676B23K26/067B23K26/4065B23K26/0624B23K26/082B23K26/384B23K26/389B23K26/40B23K2103/42B23K2103/50
Inventor 郑震雄刘新兵
Owner PANASONIC CORP