Unlock instant, AI-driven research and patent intelligence for your innovation.

Destructive-read random access memory system buffered with destructive-read memory cache

A high-speed cache and storage system technology, applied in the direction of memory system, static memory, digital memory information, etc., can solve complex problems

Inactive Publication Date: 2007-01-24
INT BUSINESS MASCH CORP
View PDF10 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

While such approaches are effective for reducing random access cycle times, the use of SRAM-based caches can take up an undesired amount of chip real estate and result in more costly resources for transferring data between DRAM and cache. complex interconnection

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Destructive-read random access memory system buffered with destructive-read memory cache
  • Destructive-read random access memory system buffered with destructive-read memory cache
  • Destructive-read random access memory system buffered with destructive-read memory cache

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0027] Disclosed herein is a random access memory system based on a corrupted read memory that is also cached by the corrupted read memory. Destructive read memory describes a memory structure that loses its data after performing a read operation, and thus, performs a subsequent write back operation to restore the data to the memory cell. If the data in the DRAM is read without immediately writing back to it, the data will no longer reside in the cell afterwards. As mentioned above, one way to improve the random access cycle time is to operate the memory array in a destructive read mode, which is combined with the scheduling of delayed write back using SRAM data cache. Also, as mentioned earlier, however, existing SRAM devices occupy more device inherent resources, and each cell generally includes four or more transistors compared to a DRAM cell having a single access transistor and storage capacitor. Therefore, the embodiment of the present invention allows the same destructive r...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

A memory storage system (10) is disclosed. In an exemplary embodiment, the memory storage system includes a plurality of memory storage banks (12) and a cache (14) in communication therewith. Both the plurality of memory storage banks (12) and the cache (14) further include destructive read memory storage elements.

Description

Technical field [0001] The present invention generally relates to integrated circuit memory devices, and more particularly to a random access memory system for destructive-read memory caches of destructive-read memory. Background technique [0002] The development of sub-micron CMOS technology has contributed to a significant increase in microprocessor speed. (Increase speed) About four times every three years, the microprocessor speed has exceeded 1Ghz. Together with these advances in microprocessor technology, more advanced software and multimedia applications have been brought, which subsequently require larger memories for the applications therein. Therefore, there is an increasing demand for larger dynamic random access memories (DRAM) with higher density and performance. [0003] In these years, driven by the demands of systems requiring greater memory capacity, DRAM structures have been developed. However, the speed of DRAM characterized by its random access time (tRAC) an...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): G06F12/00G06F13/00G06F12/08G11C7/10G11C8/00G11C8/12G11C11/401G11C11/4093
CPCG11C7/106G06F12/0897G06F12/0804G11C8/12G11C7/1039G11C11/4093G06F2212/3042G11C7/1051G11C2207/2245G06F12/0893G06F12/00G06F13/00
Inventor 布赖恩·L·吉黄重礼切幡年明宗藤正治
Owner INT BUSINESS MASCH CORP
Features
  • R&D
  • Intellectual Property
  • Life Sciences
  • Materials
  • Tech Scout
Why Patsnap Eureka
  • Unparalleled Data Quality
  • Higher Quality Content
  • 60% Fewer Hallucinations
Social media
Patsnap Eureka Blog
Learn More