Surface mount package for power semiconductor devices

Abstract

A leadframe for making an electric connection to a semiconductor die contains a plurality of notches which correspond to the edges of the die. Shorts are thereby prevented between the leadframe and electrical elements near the edge of the die, even when the leadframe is bent in the direction of the die to make a surface mount package. Alternatively or additionally, the leads in the leadframe may contain moats which prevent the epoxy or solder used to attach the leadframe to a die from spreading outward and thereby creating electrical shorts with other leads.

Description

Background technique [0001] Semiconductor devices in the form of integrated circuit chips (ICs) typically must be mounted on a flat surface such as a printed circuit board when they are incorporated into products such as computers or cellular telephones. Currently, no surface-mount semiconductor packaging technology can meet the needs of next-generation discrete power semiconductor devices and ICs. [0002] Such surface mount power packages should include at least the following features: [0003] 1. Low resistance; [0004] 2. The ability to shunt and reduce the lateral resistance in the metal interconnection of the device; [0005] 3. Low thermal resistance; [0006] 4. Ability to achieve large currents vertically (through the back) or laterally (top side); [0007] 5. High manufacturability; [0008] 6. Low intrinsic material cost (intrinsic material cost); [0009] 7. Low manufacturing cost; [0010] 8. Reliable operation in power applications; [0011] 9. Ability t...

AI Technical Summary

Problems solved by technology

While some tentative attempts have been made to introduce wireless power packages, most have encountered similar issues including stress, die cracking, alignment, and coplanarity of multiple leadframes

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