Technology for making strengthened glass circuit board and its product and application

A technology for strengthening glass and circuit boards, which is applied in printed circuit manufacturing, circuit substrate materials, printed circuits, etc., and can solve problems such as short service life, high cost, and poor electrical conductivity

Inactive Publication Date: 2002-12-04
SHANG CHUEN WEIGHTING MACHINE
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Since the flexible circuit board is pasted on the glass surface with an adhesive, once it is exposed to the sun and rain, it is easy to peel off and fall off, resulting in poor conductivity, and it needs to be updated irregularly. Not only is the service life short, but it is also easy to increase Environmental protection burden, and it also needs to manually paste the flexible circuit board on the surface of the glass level, which requires high cost, so it is not economical
[0004] Generally, the PC boards sold in the market are made of fiber material, so it is easy to cause environmental protection problems, and the surface of the flexible circuit board and PC board is easily scratched due to the formation of convex strips or convex grains, which leads to poor insulation effect. good

Method used

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  • Technology for making strengthened glass circuit board and its product and application
  • Technology for making strengthened glass circuit board and its product and application

Examples

Experimental program
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Effect test

Embodiment Construction

[0023] refer to figure 1 Shown, preparation method of the present invention comprises the following steps:

[0024] A. Take a piece of glass first, and smear a layer of silver paste on the surface of the glass with a printing screen. The composition and composition of the silver paste are 68-72 parts by weight of silver powder, 78-82 parts of coagulant, and 1-3 parts of glass powder. Parts, 3-5 parts of resin and 14-19 parts of organic solvent, the viscosity is 400±50p (poise), and placed at 150 ° C for ten minutes, until the silver paste is dry, due to the coagulant, resin and organic solvent It is a general raw material well known to those skilled in the art, so it will not be described in detail;

[0025] B. After the silver paste dries up, the glass is transported into the sintering tunnel furnace and gradually heated at 30°C;

[0026] C. When the temperature reaches 450-550°C, the glass surface is melted at high temperature, and at the same time, it is completely fused ...

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PUM

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Abstract

This invention relates to a processing method and its appliances containing uniform coating a layer of silver brei on a glass surface by a printed raster. The glass is heated from 30 deg.c to 450-550deg.c after dried. This time the glass surface is completely fused with the silver brei under hot smelting again continuously heated to 750 minus or plus 2 deg.c to get the tempered glass. Then the temperature is reduced to room temperature and a tempered glass circuit board is finished. Circuit can be directly welded on the glass surface which substitutes any conductive tempered glass.

Description

technical field [0001] The invention relates to a method for making strengthened glass circuit boards and its products and applications. Before making strengthened glass, silver paste is applied to the surface of the glass with a printing screen, and then heated together to produce mutual It is fused into a strengthened glass circuit board and electroplated to prevent the oxidation of the silver paste. It can be directly soldered on the glass surface to replace and apply to any strengthened glass that needs to be conductive, and it is not affected by the weather and has a long service life and Good insulation effect, to achieve environmental benefits and economic benefits. Background technique [0002] At present, when it is generally desired to make the glass conductive, it is mostly formed by pasting a flexible circuit board on the surface of the glass, or washing the conductive circuit into the thick capillary pores of the PC board. Its main flaws are: [0003] Since th...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/03C03B25/02C03B32/00C03C17/10C03C17/40H05B3/84H05K1/09H05K3/24
CPCC03B25/025C03B32/00C03C17/10C03C17/40C03C2217/256C03C2217/27C03C2218/119H05B3/84H05B2203/017H05K1/092H05K3/245Y02B30/00
Inventor 李武雄
Owner SHANG CHUEN WEIGHTING MACHINE
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