Protein chip of directional immobilizing antibody, its preparing method and use thereof
A protein chip and directional immobilization technology, applied in biological testing, material inspection products, etc., can solve the problems of losing the ability to bind antigen molecules, unfavorable antibody-antigen binding, and increased steric hindrance, so as to reduce non-specific adsorption , Improve analytical sensitivity, reduce the effect of steric hindrance
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Embodiment 1
[0046] Prepare a protein chip on the surface of a silicon chip for directional immobilization of antibody human immunoglobulin G (antiIgG), its structure comprising: a silicon chip 1 for integrated circuits with a thickness of 0.5mm, and a monomolecular layer of dichlorodichloromethylene formed on the silicon chip 1 The methyl silane hydrophobic polarized surface layer 2, the monomolecular layer protein A film layer 3 formed on the hydrophobic polarized surface layer 2, and the monomolecular layer antiIgG sensing film layer 4 formed on the protein A film layer 3.
[0047] The preparation of the protein chip is carried out as follows:
[0048] 1. Selection of solid substrate and surface cleaning treatment
[0049] A commercially available silicon wafer for integrated circuits with a thickness of 0.5 mm is selected as a solid substrate, and its surface is cleaned by a conventional cleaning treatment method.
[0050] 2. Formation of the second hydrophobic polarized surface layer...
Embodiment 2
[0060] Preparation of Protein Chip with Oriented Immobilization of AntiBSA Antibody on Composite Substrate
[0061] 1. Selection of solid substrate and surface cleaning treatment
[0062] A 2 μm thick gold plate is plated on a 0.5 mm thick silicon wafer, which is used as a composite solid substrate, and its surface is cleaned by a conventional cleaning treatment method.
[0063] 2. Preparation of Protein A Film Layer
[0064] Immerse the solid substrate that has been cleaned in step 1 into a protein A solution with a concentration of 1 mg / ml, soak for 30 minutes, take it out and wash it with deionized water, and a saturated adsorption film layer of protein A is formed on the surface of the gold sheet .
[0065] 3. Preparation of induction film layer
[0066] Immerse 2 / 3 of the protein A saturated adsorption film layer formed on the gold sheet in the above step 2 into the antiBSA solution with a concentration of 1 mg / ml, soak for 30 minutes, take it out and wash it with deio...
Embodiment 3
[0071] Preparation of a protein chip for directional immobilization of human serum prothrombin antibody (antiFIB) on the surface of a silicon wafer:
[0072] 1. Selection of solid substrate and surface cleaning treatment
[0073] A commercially available silicon wafer with a thickness of 0.5 mm for integrated circuits is selected as a solid substrate, and its surface is cleaned by a conventional cleaning treatment method.
[0074] 2. Formation of the second hydrophobic polarized surface layer
[0075] (1) surface hydrophilization treatment: put the clean silicon chip of the above-mentioned step 1 into 30wt% H with a volume ratio of 1:3 2 o 2 and 98 wt% H 2 SO 4 After soaking in the mixed solution for 20 minutes, take it out and wash it with deionized water for 3 times until it becomes neutral, and then obtain a silicon wafer with surface hydrophilization treatment.
[0076] (2) Surface hydrophobization treatment: put the above-mentioned hydrophilized silicon wafer into a ...
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