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Method for encapsulation in chip level by use of electroplating mask of elastic body

A technology of chip-level packaging and elastomers, applied in circuits, electrical components, electrical solid devices, etc., can solve the problems of photoresist material waste and manufacturing process complexity

Inactive Publication Date: 2003-07-23
TAIWAN SEMICON MFG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0010] The technical problem to be solved by the present invention is to provide a method that can improve the waste of photoresist material and the complexity of the manufacturing process, so as to reduce the cost of the manufacturing process

Method used

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  • Method for encapsulation in chip level by use of electroplating mask of elastic body
  • Method for encapsulation in chip level by use of electroplating mask of elastic body
  • Method for encapsulation in chip level by use of electroplating mask of elastic body

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Embodiment Construction

[0018] In order to simplify the packaging manufacturing process, avoid waste of photoresist material, and make the chip assembled on the circuit board, it can still be disassembled and redone, so the electroplating manufacturing process is combined with the packaging manufacturing process. The following will match Figure 2A to Figure 2E , a method of using an elastomer plating mask as a chip-scale package of the present invention in detail.

[0019] First please refer to Figure 2A , on the wafer 100 on which the solder pads 102 have been formed, first cover a protective layer 104, such as a polyimide (polyimide) protective layer, the protective layer 104 roughly exposes the area of ​​the solder pads 102, and then coat the protective layer 104 , forming an under-bump metal layer 106 on the wafer 100 and the bonding pad 102 under the solder bump to be formed to prevent the diffusion of other metal materials subsequently formed above it.

[0020] Please refer to Figure 2B ,...

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Abstract

The sheath layer is covered on the weft with soldering pads having been forming on. The soldering pads are exposed on the sheath layer. Then, the underlying metal with patterned lugs is formed on thesheath layer in order to prevent the diffusion of metals. The underlying metal with patterned lugs is matched to the soldering pads approximately, extended to the cutting tracks so as to be good for subsequent electroplate procedures to carry out. The elastomeric layer as the electroplate mask is formed on the sheath layer and the openings of the elastomeric layer are faced to the soldering pads.Tin, lead other solder material is electroplated into the openings. Under the temp 190 deg.C-230 deg.C, the solder material is fused to convert to the alloy soldered lugs.

Description

technical field [0001] The present invention relates to a method of using an elastomer (elastomer) electroplating mask as a wafer level package (waferlevel package), in particular to a method that can combine the electroplating process and the packaging process. Background technique [0002] After the bonding pad and protective layer are fabricated on the wafer, the encapsulation process must be carried out to protect the various components and interconnection lines formed, and to enable the components to have paths (I / O) connected to the substrate. A common package manufacturing process is to use flip-chip technology to connect solder bumps formed on pads to the substrate. In flip-chip technology, there are three main methods for forming solder bumps: solder ball mounting, stencil printing, and electroplating. The commonly used method is the electroplating method, because the solder bumps obtained by the electroplating method can obtain higher density pins (pins) and small...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/288H01L21/60H01L23/31H01L23/485
CPCH01L2924/01015H01L2924/0105H01L2924/01082H01L2224/13022H01L2924/01018H01L21/2885H01L2924/01002H01L2924/01029H01L24/12H01L2224/13099H01L2924/01022H01L2224/0401H01L23/3171H01L2924/01028H01L24/16H01L24/11H01L2924/014H01L2924/01013H01L2924/01024H01L2224/05572H01L2924/01084H01L24/03H01L2924/04941H01L2924/05042H01L2224/1148H01L2924/01079H01L2924/01007H01L2924/14H01L2924/01005H01L2924/01033H01L2924/01006H01L23/3114H01L2924/01078H01L2924/01057H01L2924/01014H01L2924/01075H01L2924/0002H01L2924/181H01L2924/351H01L2224/05552H01L2924/00
Inventor 游秀美周根申许顺良
Owner TAIWAN SEMICON MFG CO LTD