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Method for mfg. contact type modules with moulded package

A technology of molding packaging and manufacturing method, applied in the direction of electrical components, electric solid devices, circuits, etc., can solve the problems that UV glue is not as good as molding packaging, troublesome card making process, difficult product appearance control, etc.

Inactive Publication Date: 2003-07-23
SHANGHAI CHANGFENG SMART CARD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Because UV glue is a kind of liquid glue, it has great fluidity after glue dispensing and before curing, so it is very difficult to control the appearance of the product, and the consistency of the thickness and diameter of the module package is very poor. here comes the trouble
In addition, in terms of resistance to external impact, UV glue is far inferior to molded and encapsulated modules.

Method used

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  • Method for mfg. contact type modules with moulded package
  • Method for mfg. contact type modules with moulded package

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Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0016] Modules manufactured using the method of the present invention such as figure 1 As shown, it mainly includes: a molded package part 1 , a strip 2 , and a strip stepping tooth hole 3 . The present invention mainly comprises the steps:

[0017] Chip thinning and cutting: Thinning the disc chip according to certain specifications and standards, and then cutting.

[0018] Chip welding: use a chip welding machine to combine the cut chips with silver paste and strips to reach the thrust standard > 500g / mm 2 .

[0019] Gold wire ball bonding: The semi-finished products above are connected with gold wires to the solder joints of the chip and the strips to form a path, and the destructive test is to break the gold wires, and the tension standard is > 4g.

[0020] Module packaging: The semi-finished product of gold wire ball bonding is completely encapsulated with black molding compound to cover the chip and gold wire, and ensure that the gold wire leads are intact. The thrus...

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Abstract

The invention belonging to the technique area for manufacturing intelligent cards includes following steps. (1) Thinning down and cutting chip, disc wafers are thinned and cut according to the specifications and the standard. (2) Soldering chips, chips are connected to the stripes by using the chip-soldering device. (3) Gold wire ball bonding: the soldered dots of the chip are connected to the stripes so as to form channels. (4) Module encapsulation: the chip and the gold wire part are encapsulated so as to reach the standard, flattening and no cavities. (5) Module test: eiliminating the ineffective modules. Comparing with the prior art, the invention provides the higher reliability and qualified rate.

Description

technical field [0001] The invention relates to a method for manufacturing a smart card module, in particular to a method for manufacturing a molded and encapsulated contact type smart card module, which belongs to the technical field of smart card manufacturing. Background technique [0002] At present, UV packaging technology is generally used in the manufacture of smart card contact modules. The disadvantages of the current technology are: it is difficult to control the appearance of the package, the cost of equipment debugging is high, and the production efficiency is low. Especially with the development of the market, many customers have higher and higher standards for modules, and the requirements for module thickness are close to the limit of general equipment, which brings great difficulties to module production. As a result, the qualified rate of production is reduced, the production cost is increased, and the economic benefit is decreased. UV encapsulation techno...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/28
Inventor 叶柏海丁富强
Owner SHANGHAI CHANGFENG SMART CARD