Sealing wax for electronic element coil

Abstract

The present invention relates to a kind of electronic element sealing wax composite comprising petroleum wax, polymer wax, tackifier and plasticizer. The sealing wax has the features of high droppingpoint, excellent high temperature performance, good plasticity and flexibility, excellent electric performance, powerful sealing force, short solidification time, no corrosion, no impurity, etc., andhas the sealing cost lower than available sealing material with resin as main component. The sealing wax is suitable for positioning and sealing electronic tuner, inductance coil and other electronicelement coil.

Description

1. Technical field [0001] The invention relates to a wax composition, in particular to a sealing wax composition, especially a sealing wax composition suitable for positioning and sealing coils of electronic tuners and other electronic components. 2. Background technology [0002] In the two processes of automatic waxing and manual waxing in the production process of electronic components such as electronic tuners, it is required to use sealing materials to fix the hollow coil to accurately adjust the inductance of the hollow coil. The advantage of simply using ordinary paraffin or microcrystalline wax is that they are cheap, but they have defects such as poor high-temperature performance and toughness and plasticity. change. The use of resin-based sealing compounds has the advantage of good high-temperature performance, but has defects such as poor toughness and plasticity and high cost, and cannot meet the current market competition requirements for low cost. The existin...

AI Technical Summary

Problems solved by technology

The advantage of simply using ordinary paraffin or microcrystalline wax is that they are cheap, but they have defects such as poor high-temperature performance and toughness and plasticity. change

The use of resin-based sealing materials has the advantage of good high-temperature performance, but has defects such as poor toughness and plasticity and high cost, and cannot meet the current market competition requirements for low cost.

The existing patents introduce that the materials used for the sealing and positioning of the special coils for electronic components all use resin as the main component. For example, the sealing methods introduced in US 4115175 and US 5656350 all use resin to encapsulate the coils. The cost of this sealing material is relatively high. In the face of the current situation of fierce competition in the electronics industry, it is difficult to adapt to the actual requirements of market competition