Substrate diffusion and furbishing process
An effect of N reducing cost, improving performance, and simple and feasible polishing process
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Examples
Embodiment Construction
[0011] NSubstrate diffusion and polishing process. It includes the following steps:
[0012] 1. Phosphorus pre-diffusion: It is to deposit a certain amount of phosphorus atoms on the surface of the silicon wafer under certain temperature and oxygen and nitrogen atmosphere conditions;
[0013] 2. Phosphorus main diffusion: Under certain temperature and oxygen and nitrogen atmosphere conditions, the junction depth can reach the required value through high temperature diffusion to meet the performance requirements of the device;
[0014] 3. Grinding wafer: using mechanical grinding method to control the thickness and surface of the silicon wafer after main expansion;
[0015] 4. Polishing: Use a polishing liquid to polish away the damage layer on the surface of the silicon wafer after the grinding wafer, and the mirror surface with good shape layer;
[0016] 5. Cleaning: Use a mixture of electronic cleaning fluid and water to clean the polished silicon wafer to remove impurities and ...
PUM
Login to View More Abstract
Description
Claims
Application Information
Login to View More - R&D
- Intellectual Property
- Life Sciences
- Materials
- Tech Scout
- Unparalleled Data Quality
- Higher Quality Content
- 60% Fewer Hallucinations
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2025 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com