3results about How to "Simple polishing process" patented technology

This invention discloses a method for preparing a single-component InP polishing slurry, belonging to the technical field of polishing slurry. The polishing slurry comprises the following components by mass percentage: 1%–20% modified colloidal silica, 0.01%–5% oxidant, 0.001%–1% metal corrosion inhibitor, 0.001%–0.6% surfactant, with the balance being a pH adjuster and deionized water; the pH adjuster is used to adjust the pH of the polishing slurry to 2.0–5.0. The modified colloidal silica is obtained by surface grafting modification of ordinary colloidal silica with a specific bisphosphonate-sulfonylimide silane coupling agent. The bisphosphonate groups in this structure can strongly chelate the InP surface, enhancing chemical cutting and improving the removal rate; the sulfonylimide groups ionize to provide a high negative charge, which, in synergy with steric hindrance, endows the polishing slurry with excellent long-term storage stability. This invention provides a ready-to-use, highly stable, high-removal-rate, and ultra-smooth surface-forming single-component polishing slurry.

The invention relates to the technical field of bearing production polishing, and discloses a bearing ring polishing device for bearing production. A rotating seat; the self-circulation polishing assembly is used for conducting self-rotation type circulation polishing on the inner ring of the bearing; the feeding assembly is used for automatically feeding unpolished bearing rings; the self-circulation polishing assembly comprises a rotating device, a polishing device and a discharging device. The feeding assembly is installed on the frame body, and the rotating base is connected with the self-circulation polishing assembly. According to the bearing ring polishing device for bearing production, through the arranged self-circulation polishing assembly, automatic circulation type rotating inner ring polishing of a bearing ring can be achieved, clamping of operators is not needed, automatic clamping and polishing position calibration are achieved, meanwhile, automatic discharging of the polished bearing ring is achieved, and the production efficiency is improved. Therefore, the effect of quickly polishing the whole bearing ring is achieved, the polishing efficiency of the whole bearing is improved, and the working intensity and the working difficulty of operators are reduced.

The present invention discloses an LED chip based on a micro-reflector and a preparation method thereof, and relates to the field of semiconductor optoelectronic devices. The preparation method of the LED chip comprises the following steps: providing an epitaxial wafer; etching the surface of the epitaxial wafer to form a plurality of protrusions; forming a dielectric layer; polishing to expose the protrusions; forming a transparent conductive layer on the protrusions and on the dielectric layer in the grooves; forming a metal reflective layer on the transparent conductive layer; forming a bonding layer on the metal reflective layer; bonding with a second substrate; removing the first substrate to expose the N-type semiconductor layer; forming an N electrode on the N-type semiconductor layer; forming a P electrode on the second substrate to obtain an LED wafer; cutting the LED wafer to obtain an LED chip based on a micro-reflector. The implementation of the present invention can improve the luminous efficiency of the LED chip.