Non-wax polishing adsorption pad and manufacturing method thereof

Abstract

The invention discloses a non-wax polishing adsorption pad and a manufacturing method thereof. The non-wax polishing adsorption pad comprises a grinding board, a first adhesive layer, an adsorption skin, a second adhesive layer, a supporting board and a gum layer, wherein the first adhesive layer and the second adhesive layer are each made of a hot melt adhesive film. The method includes the following production steps that firstly, the grinding board, the first adhesive layer, the second adhesive layer, the adsorption skin, the supporting board and the gum layer are cut to be of certain dimensions; secondly, the grinding board and the first adhesive layer are bonded to form a grinding layer composite board; thirdly, the first plane of the supporting board and the second adhesive layer are bonded, and the second plane of the supporting board and the gum layer are bonded, so that a supporting layer composite board is obtained; fourthly, a grinding layer processed board is obtained by processing and cutting the grinding layer composite board; fifthly, the supporting layer composite board and the adsorption skin are bonded to form an adsorption skin composite board; sixthly, the adsorption skin composite board and the grinding layer processed board are bonded to form an adsorption pad semi-finished product; and seventhly, edge cutting is carried out, specifically, the non-wax polishing adsorption pad is obtained by removing redundant portions.

Description

technical field [0001] The invention belongs to the technical field of abrasive material manufacture, and in particular relates to a wax-free polishing adsorption pad and a manufacturing method thereof. Background technique [0002] The traditional polishing process of lenses, glass, wafers, sapphire and silicon wafers mainly adopts wax-coated polishing and sticking methods. The lens, glass, wafer, sapphire, and silicon wafer to be ground are bonded to the compact with wax liquid, and ground and polished on the grinding disc attached to the grinding equipment. The quality of its wax coating process and wax liquid, and the flatness of the briquette can directly affect the polishing quality of finished lenses, glass, wafers, sapphire, and silicon wafers after polishing, resulting in low pass rates (bad films, fragments, etc.) , scratches, excessive tolerances, etc.). [0003] As modern products have higher precision requirements for lenses, glass, wafers, sapphire, and silic...

AI Technical Summary

Problems solved by technology

A wax-free polishing pad for silicon wafers produced by this patent has been unable to meet the wax-free polishing and grinding of silicon wafers, wafers and other materials in contemporary society

And this patent adopts the method of directly bonding the processed mosaic layer and other layers, which is prone to problems such as misalignment, (the adhesive layer 1 needs to be cut to the same size as the mosaic layer and cut out the same hole in the middle, the bonding process The middle adhesive layer is easily misaligned with the inlay layer, and the glue of the adhesive layer seeps into the surface of the third adsorption layer to block the pores of the adsorption layer, resulting in product scrapping.

) At the same time, the adhesive layer 1 is a very thin hot melt adhesive layer, the hole in the machining center is difficult, the qualified rate of the product is low, and the cost is high

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