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Method for manufacturing ceramic multilayer circuit board

A technology of circuit boards and ceramics, applied in printed circuit manufacturing, circuit substrate materials, multi-layer circuit manufacturing, etc., can solve problems such as internal cracks

Inactive Publication Date: 2003-12-31
PANASONIC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In addition, even if an adhesive layer can be formed on the surface of the ceramic body, when the intaglio plate filled with conductive glue and the ceramic body are bonded together by hot pressing with an adhesive added therebetween, since the ceramic body Relatively soft, it will appear internal cracks

Method used

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  • Method for manufacturing ceramic multilayer circuit board
  • Method for manufacturing ceramic multilayer circuit board
  • Method for manufacturing ceramic multilayer circuit board

Examples

Experimental program
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Effect test

no. 1 example

[0033] 1A to 1E illustrate a method for manufacturing a ceramic circuit board by forming conductive patterns on a ceramic body by a thick-film intaglio transfer process.

[0034] In FIG. 1A , a conductive paste 12 is filled into an intaglio plate 11 having grooves made by an excimer laser using a ceramic blade or the like and dried. As a film for gravure, after surface treatment, a heat-resistant material such as polyimide or aramid is used in advance, for example, a release agent is applied to facilitate peeling and transfer.

[0035] In addition, as the conductive paste 12 , a silver-based paste that can burn at 850° C. to 900° C. is used. The intaglio plate 11 filled with the conductive glue 12 is dried at 100° C. to 150° C. for 5 to 10 minutes. After drying, the volume of the conductive glue 12 filled in the grooves of the gravure plate 11 decreases due to the evaporation of the solvent in the glue. Therefore, filling and drying of the conductive paste 12 are repeated un...

no. 2 example

[0062] 2A to 2E show a method of manufacturing a ceramic circuit board in which a conductor pattern is formed on a ceramic body by a thick film gravure transfer process. Elements similar to those in the first embodiment have the same reference numerals.

[0063] FIG. 2A shows the process of filling the conductive paste 12 in the gravure 11 . The details are similar to Fig. 1A in the first embodiment.

[0064] Next, as shown in FIG. 2B , an adhesive solution is used to form a uniform adhesive layer 21 on the gravure 11 filled with the conductive paste 12 by dipping or using a roll coater. The adhesive solution is obtained by dissolving thermoplastic resins such as butyral resins and acrylic resins in organic solvents such as toluene, acetone, ethylacetate and formazan. Ethyl ketone, and preparation.

[0065] Next, as shown in FIG. 2C, a conductor pattern is formed on the ceramic body 13 by temporarily transferring the conductive paste. The transfer of the conductive paste i...

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Abstract

By increasing the quantity of resin binder of at least one of conductive paste and ceramic green sheet, adhesion between conductive film and the ceramic green sheet is improved when an intaglio filled with the conductive paste is hot pressed on the ceramic green sheet. As a result, transfer failure at intaglio transfer is removed and internal fracture of the ceramic green sheet is suppressed. Also, by coating an adhesive layer on an intaglio filled with conductive paste, adhesion with ceramic green sheet is improved and transfer failure at intaglio transfer is suppressed.

Description

technical field [0001] The invention relates to a method for manufacturing a ceramic multilayer circuit board. Background technique [0002] In recent years, ceramic multilayer wiring boards have mainly been used as low-temperature-fired boards and used as small components such as personal computers and cellular phones. When manufacturing this type of ceramic multilayer circuit board, usually a plurality of ceramic green sheets are laminated. Usually, the inner-layer lead conductor is formed by screen printing, and the outer layer is formed by screen printing, thin film photolithography or thick film photolithography (eg, DuPont's Fodel). -layer) lead conductor. [0003] In electronic parts that are extremely miniaturized for use in such as cellular phones, printed wiring boards have built-in inductance elements (L), capacitance elements (C) or resistance elements (R). This led to the development of L-C-R coupled circuits with filters such as filters. For L-C-R elements ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/03H05K3/20H05K3/38H05K3/46
CPCH05K3/4629H05K3/386H05K3/207H05K1/0306H05K3/4611H05K2203/0113
Inventor 桥本晃胜又雅昭
Owner PANASONIC CORP
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