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Film with multilayered metal and process for producing the same

A technology of metal thin film and composite thin film, applied in the fields of printed circuit manufacturing, metal layered products, chemical instruments and methods, etc.

Inactive Publication Date: 2004-01-21
TOYO KOHAN CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] However, in the conventional method of laminating composite metal foil on a film, there are problems in terms of time and cost when relatively thick metal foil is required.
In addition, there are complicated process problems such as vacuum process and wet process must be used together

Method used

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  • Film with multilayered metal and process for producing the same
  • Film with multilayered metal and process for producing the same
  • Film with multilayered metal and process for producing the same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0048] A polyimide film with a thickness of 50 μm was used as the polymer film. In addition, a 35 μm thick copper foil was used as the metal foil.

[0049] ① Forming a thin film on a polymer film

[0050] On one side of the polymer thin film 22, a nickel thin film as the metal thin film 24 was formed with a thickness of 300 nm by sputtering. This surface serves as a bonding surface with the metal foil.

[0051] ②Lamination of metal foil

[0052] A metal thin film composite film 28 in which a nickel thin film is formed on the surface of the polyimide film 22 and a copper foil 26 are provided on respective unwinding rolls 62 , 64 .

[0053] The metal thin film composite film 28 and the copper foil 26 unrolled from the film unwinding roll 62 are partially wound on the water-cooled electrode rolls 72, 82 provided in the vacuum vessel 52, and are sputtered in the first and second etching devices 70, 80. Radiation etching treatment and activation treatment.

[0054] Then, the m...

Embodiment 2

[0056] A polyimide film with a thickness of 50 μm was used as the polymer film. In addition, copper foil with a thickness of 50 μm was used as the metal foil.

[0057] ①Activation treatment

[0058] The polyimide film 22 and the copper foil 26 are set in a multilayer metal laminate composite film manufacturing apparatus 50 . The polyimide film 22 unrolled from the film unwinding drum 62 and the copper foil 26 unrolled from the metal foil unwinding drum 64 are respectively wound on the water-cooled electrode rollers 72, 82 in the vacuum vessel 52, and in the activation treatment device 70, It is activated by sputter etching.

[0059] ②Formation of metal thin film

[0060] After the activation treatment, the polyimide thin film 22 is wound on the water-cooled electrode roll 72 and sent to the sputtering device 90 as it is to form a nickel thin film with a thickness of 200 nm as the metal thin film 24 .

[0061] ③Pressure joint

[0062] The joint surfaces of the polymer film...

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Abstract

A film which has a multilayered metal and is obtained by bonding a polymer film having a thin metal layer formed on a surface thereof to a metal foil having a given thickness without using an adhesive. It has a given thickness and is adhesive-free. The film having a multilayered metal is obtained by preparing a polymer film having a thin metal layer superposed on a surface thereof, activating both the surface of the thin metal layer and a surface of a metal foil, and press-bonding the activated thin-metal layer surface to the activated metal foil surface.

Description

technical field [0001] The invention relates to a multi-layer metal composite film formed by laminating composite polymer film and metal foil without adhesive and its manufacturing method. Background technique [0002] Conventionally, various metal foil laminated composites in which a metal thin film is laminated on a polymer film have been proposed. [0003] For example, a metal foil laminate composite in which a metal film is formed on a heat-resistant film represented by polyethylene terephthalate and polyimide has excellent mechanical properties, electrical properties and heat resistance characteristics, and is Used on flexible printed circuit boards, etc. [0004] As a method of laminating a composite metal foil on a polymer film, there is a method of bonding the metal foil and the polymer film using an adhesive (Japanese Patent Application Laid-Open No. 11-20786). [0005] However, organic adhesives have poor thermal performance compared with thin films and metals, a...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B32B15/08B32B37/20H05K3/00H05K3/02H05K3/38
CPCB32B2398/00B32B2311/00B32B38/0008B32B38/162B32B2038/0092B32B2379/08B32B2309/68H05K3/388H05K2201/0355B32B2367/00B32B2037/0092B32B2457/08B32B15/08B32B37/20H05K3/025Y10T428/31681
Inventor 西条谨二吉田一雄冈本浩明大泽真司
Owner TOYO KOHAN CO LTD