Electronic circuit installation wiring substrate manufacturing method based on lead-free soldering tin

Abstract

Provided is an electronic circuit installation wiring substrate manufacturing method based on lead-free soldering tin for preventing a decrease in yield due to a defect of soldering. This manufacturing method includes a processes for investigating mounted components, investigating printed boards, investigating mass-producing facilities, determining the composition of lead-free solder according to information on them, selecting paste and flux, optimizing process conditions, judging whether or not the process conditions are practical according to the evaluation obtained through the processes; optimizing the temperature profile of soldering, verifying products, examining whether or not a solder defect is caused and judging whether or not the technique is proper as a lead-free technique, verifying mass-productivity, generating and confirming mass-production management standard, and judging whether a mass-production technique has been established in those processes.

Description

technical field [0001] The present invention relates to a method of manufacturing a mounting wiring substrate constituting an electronic circuit, and particularly relates to a method suitable for mounting using lead-free solder. Background technique [0002] Generally, in an electronic device, a wiring pattern is formed on a substrate material such as glass epoxy resin, a terminal portion for mounting an electronic component, a via hole for connecting between multilayer wiring patterns or for connecting an electronic component, etc. are used. An electronic circuit manufactured by mounting electronic components on a substrate and electrically and mechanically joining them by soldering. In addition, in this soldering step, the heating temperature needs to be higher than the melting temperature of the solder and lower than the heat-resistant temperature of the mounted electronic component. [0003] However, conventionally, Sn-Pb eutectic solder has been used as a solder materi...

AI Technical Summary

Problems solved by technology

[0011] The present invention is proposed in order to solve the above-mentioned problems in the process design and mass production of electronic circuit mounting wiring substrates using lead-free solder, and its purpose is to make electronic circuits mounted using lead-free solder that do not cause environmental problems The design of the manufacturing process of the mounting wiring substrate and the establishment of the mass production process become easy, and in the mass production process of the mounting wiring substrate, it provides a management method to prevent the yield from falling due to the occurrence of soldering defects.

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