Preparation method of protein chip

A protein chip and substrate technology, applied in the field of protein chips or immunoassays, can solve the problems of signal interaction, high signal background, shedding, etc.
CN1534295AInactive Publication Date: 2004-10-06上海裕隆神光医学检验实验室有限公司

Patent Information

Authority / Receiving Office
CN · China
Current Assignee / Owner
上海裕隆神光医学检验实验室有限公司
Publication Date
2004-10-06
Estimated Expiration
Not applicable · inactive patent

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Abstract

A solid carrier of protein chip is composed of a substrate, a biotin marked enclosing substance layer on said substrate, and an avidin layer on said enclosing substance layer. Its advantages are less diffusion of sample applied point and high sensitivity. A process for preparing the solid carrier of protein chip is also disclosed.
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Description

technical field

[0001] The invention belongs to the field of protein chip or immunoassay, and more specifically relates to a new protein chip carrier and a processing method thereof. Background technique

[0002] In order to improve the detection throughput and detection efficiency, a microarray enzyme-linked immunoassay technology, also known as protein chip technology, has been developed in recent years. It uses the specificity of antibody-antigen binding, that is, the immune response to detect samples.

[0003] The simplified model of protein chip construction is: select a solid phase carrier that can firmly bind protein molecules (antigens or antibodies), thus forming a protein microarray, that is, a protein chip. The protein microarray is constructed on the substrate, and each point in the array represents an independent biochemical reaction, so that many reactions are integrated on a small carrier.

[0004] In the process of protein chip manufacturing, the preparation...

Claims

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