Base plate processing device, coating device and coading method

A technology for a substrate processing device and a coating device, which can be applied to a device for coating liquid on a surface, a coating device, a photoengraving process coating device, etc., can solve problems such as adverse effects on film thickness uniformity, changes in horizontal balance, and the like, Achieve the effect of improving position accuracy and uniform film thickness

Inactive Publication Date: 2004-10-13
HOYA CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0013] However, this CAP coating machine has the following problems on the opposite side of having the above-mentioned convenience: Due to the backlash of the rotating mechanism, etc., the adsorption plate also slightly moves during coating, resulting in a change in the horizontal balance, thereby Adverse effect on film quality (e.g. film thickness uniformity)

Method used

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  • Base plate processing device, coating device and coading method
  • Base plate processing device, coating device and coading method
  • Base plate processing device, coating device and coading method

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Embodiment Construction

[0041] Hereinafter, various embodiments of the present invention will be described with reference to the drawings.

[0042] [Substrate Processing Equipment]

[0043] First, refer to figure 1 2, an embodiment of the substrate processing apparatus of the present invention is described.

[0044] figure 1 FIG. 2 is a schematic side view of the substrate processing apparatus, and FIG. 2 shows a schematic front view thereof.

[0045] Such as figure 1 As shown, the substrate processing apparatus 1 has: a substrate processing unit 2 arranged on the base frame 11; an adsorption unit 3 arranged on the moving frame 12; a moving unit for moving the moving frame 12 horizontally on the base frame 11 4; a holding unit 5 that can detachably hold the substrate 10; and a control unit not shown.

[0046] The substrate processing unit 2 is used to process the substrate 10 with the surface to be processed facing downward. The substrate processing unit 2 is provided substantially in the cente...

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Abstract

Provided is a substrate process equipment, a coating unit and a coating method capable of adhering the substrate on an adhesion board with the substrate surface to be processed directed downward, without a rotating mechanism. A coating apparatus 1a for forming a coating film on a coated surface by raising a coating liquid that is reserved under a substrate 10 by a capillary phenomenon of a substrate processing means 2, bringing the raised coating liquid into contact with the coated surface of the substrate 10 that is directed downward, and then moving relatively the substrate processing means 2 and the substrate 10, comprises a holding means 5a for holding detachably the substrate 10, a chucking means 3 for chucking the substrate 10 from the holding means 5a in a state that the processes surface of the substrate 10 is directed downward, and a moving means 4 for moving relatively the substrate processing means 2 and / or the chucking means 3 in a horizontal plane.

Description

technical field [0001] The present invention relates to a substrate processing apparatus for processing a substrate with the surface to be processed of the substrate facing downward, and particularly relates to a method for applying a liquid such as photoresist with the surface to be coated of the substrate facing downward. Coating device and coating method. Background technique [0002] Patent Document 1: JP-A-2001-62370 [0003] Conventionally, as a coating device (coater) for coating a coating liquid such as a photoresist on a substrate such as a silicon wafer, a spin coater that drips the coating liquid toward the center of the substrate is generally used. , and then the substrate is rotated at a high speed, whereby the coating liquid is diffused by centrifugal force, and a coating film is formed on the surface of the substrate. [0004] In addition, in the above-mentioned spin coater, swelling called a resist bead may occur on the peripheral portion of the substrate. ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G03F7/16B05C3/18B05C5/02B05C11/105B05C13/02B05D1/26B05D7/00H01L21/00H01L21/027H01L21/68
CPCH01L21/68H01L21/6715B21F23/00B21F27/124
Inventor 元村秀峰
Owner HOYA CORP
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