Signal transmission structure
A signal transmission and signal wire technology, applied in semiconductor/solid-state device components, semiconductor devices, printed circuits, etc., can solve the problem that the quality of high-frequency electronic signal transmission cannot be significantly improved, and the equivalent dielectric of electroplating line segments cannot be effectively reduced. Constant and other issues to achieve the effect of improving impedance mismatch and increasing resonance frequency
Active Publication Date: 2004-11-10
VIA TECH INC
View PDF0 Cites 0 Cited by
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
However, although reducing the line width of the electroplating line segment can increase the impedance of the electroplating line segment to improve the impedance mismatch of the signal wire caused by the electroplating line segment, for the signal transmission structure applied to the transmission of high-frequency signals, by reducing the electroplating The line width of the line segment still cannot effectively reduce the effective permittivity of the plated line segment to increase the resonant frequency of the plated line segment.
Therefore, the transmission quality of high-frequency electronic signals cannot be significantly improved when the resonant frequency of the electroplating line segment cannot be increased.
Method used
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View moreImage
Smart Image Click on the blue labels to locate them in the text.
Smart ImageViewing Examples
Examples
Experimental program
Comparison scheme
Effect test
Embodiment Construction
[0046] Please refer to figure 2, which represents a three-dimensional schematic diagram of a signal transmission structure of a preferred embodiment of the present invention. The signal transmission structure 200 is suitable for a circuit substrate with multiple patterned circuit layers, for example, a circuit substrate with four patterned circuit layers. The signal transmission structure 200 may include a signal wire 210, a plated wire segment 220, a ground plane 230, and a power plane 240, wherein the ground plane 230 is disposed above the power plane 240 and substantially parallel to the power plane 240, and the signal wire 110 may be composed of a first signal line segment 210a, a conductive via (via) 210b and a second signal line segment 210c. The first signal line segment 210a is disposed above the ground plane 230, and the second signal line segment 210c is disposed below the power plane 240, wherein the first signal line segment 210a, the ground plane 230, the power ...
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More PUM
Login to View More Abstract
The invention is a signal transmission structure, applied to a line basal plate and at least including a signal wire, a plated wire segment and a reference plane, where the signal wire is set on one side adjacent to the reference plane and connected with the plated wire segment. In addition, the plated wire segment is set on one side adjacent to the reference plane and has a non-reference region corresponding to the plated wire segment. The signal wire's structure can improve the unmatchable phenomenon of resistance of the signal wire, caused by the plated wire segment.
Description
technical field [0001] The present invention relates to a signal transmission structure, and in particular to a signal that can improve the impedance mismatch of signal wires caused by plating bars and increase the resonant frequency of the plating bars. transfer structure. Background technique [0002] On the circuit substrate, it is used to electrically connect the signal wires between two components or two terminals, and the line width must be consistent so that when the electronic signal is transmitted on the signal wires, the characteristic impedance of the signal wires impedance) can remain unchanged, especially for high-speed and high-frequency signal transmission, the two ends of the signal wire need to be designed with a good impedance matching (impedance matching) to reduce the electronic signal caused by the impedance mismatch of the signal wire The resulting reflection reduces the insertion loss during signal transmission and relatively increases the return loss...
Claims
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More Application Information
Patent Timeline
Login to View More Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/48H05K1/00
CPCH01L2924/0002
Inventor 李胜源
Owner VIA TECH INC