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Polyphenyl board composite thermal insulative wall and constructing process

A composite thermal insulation and polystyrene board technology, applied in thermal insulation, building components, construction and other directions, can solve the problems of wind pressure resistance defects, slow construction speed of thermal insulation mortar, etc., to enhance wind pressure resistance performance, good bonding effect, good adhesion The effect of thermal insulation

Inactive Publication Date: 2005-02-23
黄振利
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The invention provides a polystyrene board composite thermal insulation wall and its construction technology, which not only solves the problem of wind pressure resistance defects when the polystyrene board is pasted, but also solves the problems of slow construction speed of the thermal insulation mortar, and makes the wall have great Good thermal insulation performance

Method used

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  • Polyphenyl board composite thermal insulative wall and constructing process
  • Polyphenyl board composite thermal insulative wall and constructing process
  • Polyphenyl board composite thermal insulative wall and constructing process

Examples

Experimental program
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Effect test

Embodiment 1

[0033] Example one see figure 1 , The wall finishing layer is paint layer 8. Fully brush concrete interface mortar 2 on the base wall 1, and then apply 10-20mm thick thermal insulation mortar to form the bonding layer 3. Then press the polystyrene board 4 on the bonding layer 3, and use 2~3 if necessary A plastic expansion anchor 9 anchors the polystyrene board. After the bonding layer 3 is basically dry, apply 10-20mm thick insulation mortar as the leveling layer 5. After the leveling layer is basically dry, apply 3~5mm thick anti-cracking mortar and press into the alkali-resistant glass The fiber mesh cloth forms the anti-cracking mortar layer 6, and after it is basically dried, it is brushed with an elastic primer and a flexible water-resistant putty 7, and then the coating layer 8 is constructed. If the polystyrene board 4 is pasted and anchored, its flatness is very good, no partial repair is needed, and no fireproof performance needs to be improved, the leveling layer 5 can...

Embodiment 2

[0034] See the second embodiment figure 2 , The wall finishing layer is the paint layer 8, and the polystyrene board 4 has plug holes 12.

Embodiment 3

[0035] See the third embodiment image 3 , The wall finishing layer is the coating layer 8, and the surface of the polystyrene board 4 has a thermal insulation mortar leveling layer 5.

[0036] Implementation column four see Figure 4 , The wall finishing layer is the paint layer 8, the polystyrene board 4 has plug holes 12, and has a leveling layer 5.

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Abstract

The present invention relates to a polypenyl plate composite heat-insulating wall body and its construction process. Said wall body has base layer wall body, boundary surface mortar layer, adhesive coating, polyphenyl plate, anticrack mortar layer and finishing coat from interior to exterior successively. Its polyphenyl plate is adhered and fixed on the base layer wall body by means of heat-insulating mortar, on the polyphenyl plate there are some air-permeable plug-holes, if necessary, the polyphenyl plate can be strengthened and fixed by using plastic expanding anchor, and according to the requirements it can be leveled by using heat-insulating mortar. Said invention can raise heat-insulating effect and construction speed.

Description

Technical field [0001] The invention relates to a polystyrene board composite thermal insulation wall and a construction process. Background technique [0002] Existing polystyrene board walls are usually glued to the base wall with adhesive. In order to save adhesives, point bonding or strip bonding is usually used. In this way, it is between the polystyrene board and the base wall. A large cavity is formed in the space. The existence of this cavity significantly reduces the ability of the thermal insulation wall to resist wind pressure, which makes the wall with polystyrene board a safety hazard. If the full adhesion method is adopted, the consumption of the adhesive will be large, and the cost will increase accordingly. At the same time, the thermal conductivity of the adhesive is relatively high, which makes little contribution to the insulation performance of the wall. If the wall is directly insulated with insulation mortar, although the safety is very reliable, because the...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): E04B1/80E04C2/284
Inventor 朱青黄振利
Owner 黄振利
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