Four-freedom face-down spline connecting head

A bonding head and degree of freedom technology, applied in transportation and packaging, furnace, electric charge manipulation, etc., can solve the problems of easy to produce singular shapes, reduce working space, and low manufacturing precision, and meet the requirements of large stroke rotation, Strong load capacity and compact structure
CN1624891AActive Publication Date: 2005-06-08WUHAN HUAWEIKE INTELLIGENT TECH
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Patent Information

Authority / Receiving Office
CN · China
Current Assignee / Owner
WUHAN HUAWEIKE INTELLIGENT TECH
Publication Date
2005-06-08

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Abstract

The invention discloses a four-degree of freedom inverted spline combining end,including a double-degree of freedom series mechanism based on the ball spline, a double-degree of freedom snout mechanism and an absorbing snout.In the series mechanism, the ball spline shaft connects to the slide block through the turning assistance, the driving slide block realizes the inverted spline combining end to move in Z direction; the sleeve is fixed on the rack through another turning assistance, the stir folk of the driving and the sleeve realizes the inverted spline combining end to turn in the Z direction; the shunt mechanism is composed of the upper and the lower platforms, and a fixing branch chain that connects the upper and the lower platforms and two movable branch chains, the movable assistance of the two driving movable branch chains realizes the inverted spline combining end to slightly turn in X, Y direction ;the upper platform of the shunt mechanism fixedly connects with the ball spline shaft, the lower platform is equipped with the picking-up absorbing snout. This invention realizes the degree of freedom needed by the leveling,aiming, bonding,and has the characteristics of fast resolution, high strength and precision and tight structure.
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Description

technical field

[0001] The invention belongs to the field of semiconductor packaging equipment manufacturing, and relates to a hybrid mechanism four-degree-of-freedom flip-chip bonding head based on a parallel mechanism, which realizes the space required for leveling, alignment and bonding in the chip flip-chip bonding process sports. Background technique

[0002] Flip chip technology (Flip Chip) is a method in which a chip is directly mounted and interconnected with a substrate in a bump array structure. Compared with chip interconnection technologies such as wire bonding, flip-chip technology has great advantages in terms of size, appearance, flexibility, reliability, precision, and cost. At present, flip chips are widely used in various electronic products such as electronic watches, mobile phones, computers, disks, walkmans, LCDs, and mainframes.

[0003] In order to achieve high-density (up to 1600 bumps), high-precision (bump minimum pitch 200um) flip-chip interconne...

Claims

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