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Sn-zn or Sn-AgBi series leadless parent metal containing trace doped metal and its preparation method

A technology of lead-free solder and trace metals, applied in metal processing equipment, welding equipment, welding/cutting media/materials, etc., can solve problems such as alloy drift, poor thermal shock resistance, and high melting point of lead-free solder

Inactive Publication Date: 2005-08-10
FUDAN UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, the existing lead-free solder still has problems such as high melting point, easy oxidation, high cost, etc.
Using Bi, Zn and other metals that can form low-eutectic alloys with tin in lead-free solder can reduce the melting point of the solder, but there are problems with the mechanical properties of these solders, such as poor ductility and poor thermal shock resistance (K. Suganuma, Current Opinion in Solid and Materials Science, 2001, 5:55-64)
In addition, the use of low melting point metals such as Zn and Bi to fire lead-free solders also has the problem that active metals are easily oxidized, and due to their low evaporation temperature, the components of the alloy will drift under high temperature or vacuum conditions, such as Zn The evaporation temperature range at 1Pa is only 400°C-410°C, which will inevitably cause waste of materials and complicate the process

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0019] Example 1, solder SnAgCuBiNi0.1, the weight ratio of each component is: Sn, 93.4%; Bi, 3%; Ag, 3%; Cu, 0.5%; Ni, 0.1%.

[0020] Mix Ni powder and Sn with a weight ratio of 0.1:93.4, put them into a device with a vacuum degree of 1Pa, control the temperature between 500°C and 600°C for 1.5 hours, and cast the alloy into blocks. The alloy was mixed with Bi particles, Ag powder, and Cu powder in a weight ratio of 93.5:3:3:0.5, fired at 400° C. for 1 hour under nitrogen protection, and poured into a mold to form a block.

Embodiment 2

[0021] Example 2, solder SnAgCuBiMn0.1, the weight ratio of each component is: Sn, 93.9%; Bi, 3%; Ag, 2.5%; Cu, 0.5%; Mn, 0.1%.

[0022] The preparation method is the same as that of Example 1, but Ni is replaced by Mn, the Sn-Mn alloy is prepared first, and then mixed with other metals.

Embodiment 3

[0023] Example 3, solder SnZnAgNi0.1, the weight ratio of each component is: Sn, 88.9%; Zn, 9%; Ag, 2%; Ni, 0.1%.

[0024] The preparation method is similar to that of Example 1, the Sn-Ni alloy is first prepared, then the alloy is mixed with Zn particles and Ag powder according to the weight ratio of 89:9:2, and the mixture is heated in an inert gas (N 2 ) under the protection of 400 ° C for 1 hour, and then casting.

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PUM

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Abstract

A non-lead Sn-Zn Sn-Ag-Bi solder containing trace doped metals and its preparing process are disclosed. It features that the Ni, Mn and Co or Fe are contained for low smelting point, and high mechanical performance and infiltration performance.

Description

technical field [0001] The invention belongs to the technical field of lead-free solder, in particular to lead-free solder containing a small amount of doped metal and a preparation method thereof. technical background [0002] Metal solder is widely used in mechanical and electrical connections in daily life, such as welding of electronic circuits and components, welding and sealing of water pipes and cans, etc. As we all know, lead-tin (Sn / Pb) alloy is the most widely used soldering material, but lead-containing compounds are one of the most harmful chemicals to humans and the environment. Countries around the world are increasingly restricting legislation on lead-containing solder. Electronics Product manufacturing and other related industries have an increasing demand for new environmentally friendly materials that can replace lead-containing solder. Therefore, the development of alternative lead-tin alloys as soldering materials—lead-free solders has received more and ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B22F3/10B23K35/26
Inventor 唐兴勇王文海肖斐俞宏坤谷博华彤
Owner FUDAN UNIV
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