Epoxy resin binding agent for sand paper and its preparation method

A technology of epoxy resin and binder, applied in the field of materials, can solve the problems of easily falling off sand, low grinding efficiency, low bonding strength, etc., and achieve the effects of firm bonding, improved performance, and high curing strength

Inactive Publication Date: 2005-08-10
WUHAN UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, alkyd varnish, amino resin paint, etc. are mainly used as the binder of sandpaper. Due to the defects of low bonding strength and poor heat resistance of these resins, when the sandpaper is polished, it is easy to fall off the sand grains, resulting in grinding efficiency. lower question

Method used

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Examples

Experimental program
Comparison scheme
Effect test

preparation example Construction

[0028] 2. Preparation method of epoxy resin adhesive for sandpaper

[0029] The epoxy resin adhesive for sandpaper is prepared by mixing components A, B and C, and the composition of components A, B and C is the same as above. The preparation method of epoxy resin adhesive for sandpaper is as follows, and its preparation step comprises:

[0030] (1) Preparation of component A: Pour 67-80% of epoxy resin and 20-33% of diluent into the reaction kettle in turn, and stir while pouring, and mix evenly.

[0031] (2) Preparation of component B: Pour 50-80% of curing agent and 20-50% of toughening agent into the reaction kettle in sequence, and stir while pouring, and mix evenly.

[0032] (3) Mixing and preparation: Firstly, the prepared A and B components are mixed and prepared at a ratio of 100:7 to 120 by weight, and then the third component is added to a ratio of 25 to 60 by weight, and the mixture is evenly stirred to obtain the epoxy resin for sandpaper. Resin binder.

[0033...

Embodiment 1

[0037] Pour 67% of epoxy resin and 33% of allyl glycidyl ether of component A into the reaction kettle in sequence, and pour in while stirring to make it evenly mixed; 50%, polypropylene glycol diglycidyl ether 50%, poured into the reaction kettle in turn, and poured in while stirring to make it evenly mixed. Then mix components A and B according to the ratio of 100:7, stir evenly, then add 25% toluene to adjust the viscosity, stir evenly, and obtain the epoxy resin adhesive for sandpaper.

Embodiment 2

[0039] Pour 80% of epoxy resin and 20% of allyl glycidyl ether in component A into the reaction kettle in turn, and pour in while stirring to make it evenly mixed; 80%, polypropylene glycol diglycidyl ether 20%, poured into the reaction kettle in turn, and poured in while stirring to make it mix evenly. Then mix components A and B according to the ratio of 100:120, stir evenly, then add 43% toluene to adjust the viscosity, stir evenly, and obtain the epoxy resin adhesive for sandpaper.

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PUM

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Abstract

An epoxy resin adhesive for abrasive paper is prepared from the component A composed of epoxy resin and diluent, the component B consisting of solidifying agent and toughening agent and the component C which is solvent through proportionally mixing component A with B, stirring, proportionally adding component C and stirring.

Description

technical field [0001] The invention relates to the field of materials, in particular to an epoxy resin adhesive for sandpaper and a preparation method thereof. Background technique [0002] Sandpaper has been widely used in many industries because of its various specifications and low price. At present, alkyd varnish, amino resin paint, etc. are mainly used as the binder of sandpaper. Due to the defects of low bonding strength and poor heat resistance of these resins, when the sandpaper is polished, it is easy to fall off the sand grains, resulting in grinding efficiency. lower question. Contents of the invention [0003] The technical problem to be solved by the present invention is to provide an epoxy resin adhesive for sandpaper and a preparation method thereof. The epoxy resin adhesive has excellent bonding performance, thereby being able to overcome the problems existing in the current alkyd resin and the like, and can also improve the brittleness of epoxy. [000...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24D3/28C09J163/00
Inventor 黄志雄李俊菊秦岩谢文峰梅启林李建于浩
Owner WUHAN UNIV OF TECH
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